Film-Like Adhesive Barrier Layer for Copper Ion Blocking
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Solution Overview
Problem
Existing film-like adhesives are insufficient in preventing the movement of heavy metal ions, particularly copper ions, which can cause operation failures in semiconductor packages due to diffusion into silicon circuits, and conventional gettering methods are inadequate for ultrathin wafers.
Innovation Solution
A film-like adhesive with a specific resin composition and filler distribution, featuring a region with decreasing filler content near the surface and a region with constant filler content, providing a barrier function against heavy metal ion movement, and an integrated adhesive film structure for semiconductor manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional gettering methods (IG or EG) are used, then heavy metal ion trapping is achieved, but chip thickness reduction and mechanical strength deteriorate
Solution Approach 1:
The patent introduces a film-like adhesive as an intermediary layer between the copper substrate and silicon wafer. This adhesive contains a barrier layer with specific resin composition and filler distribution that mediates the interaction between heavy metal ions and the silicon crystal, preventing ion diffusion without requiring internal or external gettering layers that would increase chip thickness
Solution Approach 2:
The patent changes the physical and chemical parameters of the adhesive film by controlling the filler content distribution (creating regions with different filler concentrations) and resin composition. This parameter optimization enables the adhesive to achieve both adequate mechanical strength and effective barrier function against heavy metal ion migration
2Reliability
If filler content is increased to improve barrier function, then heavy metal ion prevention is improved, but adhesive properties and handleability deteriorate
Solution Approach 1:
The patent applies local quality by creating non-uniform filler distribution within the adhesive film. The barrier layer contains regions with varying filler content, where certain areas have higher filler concentration to provide barrier function, while other areas maintain lower filler content to preserve adhesive properties and handleability during processing
Solution Approach 2:
The patent uses composite materials by combining resin components with filler particles in a controlled distribution pattern. The composite structure consists of a barrier layer with specific resin-filler composition that provides both mechanical integrity and ion barrier functionality, achieving a balance between protective and operational requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive effectively prevents heavy metal ion migration, maintaining mechanical strength and handleability, while enabling efficient semiconductor device assembly by integrating dicing and die-bonding processes.
Implementation Method 1
the film-like adhesive has a barrier function of preventing movement of heavy metal ions
Implementation Method 2
when the film-like adhesive is cured by heating, the film-like adhesive satisfies Formula (1) below
Implementation Method 3
A film-like adhesive formed of a resin composition having thermosetting properties
Data Source
AI summary
A film-like adhesive containing a thermosetting resin component and a filler, in which the film-like adhesive has a single layer structure including a first surface and a second surface, and has a region A in the vicinity of the first surface, the region in which a content of the filler decreases in a direction from the second surface toward the first surface, and a region B in which the content of the filler does not substantially change in a direction from the region A toward the second surface, in which when the film-like adhesive is cured, the film-like adhesive satisfies Formula (1) below:a×(b/c)>50(1)in which a thickness of a region A after thermal curing is a (nm), an elastic modulus of a region B is b (Pa), and an elastic modulus at a cleaved surface of mica is c (Pa).