Adhesive Processes TRIZ Cases

A graded-filler adhesive film blocks copper ion migration into silicon while preserving strength, handleability, and integrated dicing die-bonding.

Carbon black in a curable temporary fixation film balances strong wafer bonding with clean light-irradiation release during semiconductor processing.

Controlled heat shrinkage and stimulus-releasable adhesion keep electronic components aligned during sealing and allow clean film removal.

UV-weakened adhesive sheets hold large-area graphene securely, then release it cleanly to improve transfer rate and reduce damage.

Silicone seam bonding replaces stitched airbag seams to prevent fabric tearing and improve pressure retention during deployment.

An adhesive-filled bent current collector tab prevents sagging, preserves pouch-cell space, and helps raise energy density.

An adhesive member fixes the bent current collector tab to prevent sagging, freeing more case space and improving secondary battery energy density.

An epoxy coating with phenolic and amine curing agents suppresses stress strain and preserves adhesion strength in hot laminated motor cores.

A phosphate ester additive in copper bonding paste limits viscosity change during storage, enabling consistent application and reliable bonding.

Atmospheric plasma removes silicone and hydrocarbon residue from chip surfaces, restoring hydrophilicity and strengthening die-to-wafer bonds.

A raised outer-circumference pattern and embedded protection sheet reduce wafer TTV, warping, and cracking during back grinding.

A polyimide precursor with an oxime photoinitiator improves exposure sensitivity and heat resistance to suppress C2W hybrid bonding voids.

A dual-unit release layer uses UV and cleansing-agent decomposition to separate thick bonded substrates with fewer fabrication steps.

Surface unevenness and tuned shear modulus let the adhesive sheet hold semiconductor elements during transfer, then release them cleanly.

A phosphate and vegetable oil modified polyurethane adhesive improves aluminum alloy bonding while resisting moisture, skinning, and bubbles.

A blue backing improves radiation absorption for faster, more uniform adhesive curing, stronger bonding, and defect masking in electrical insulation tape.

A low-modulus UV-cured bonding composition improves heat resistance and clean release for temporary fixation of thin substrates down to 50 μm.

A protective film bonded to pouch-cell corners maintains shape during degassing and resealing, reducing cracks, leakage, and defects.