Hybrid Bonding Insulation Membrane for Void-Free C2W Joining

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

In C2W hybrid bonding for semiconductor devices, the use of inorganic insulating membranes can lead to voids at the joint interface due to foreign matter adhesion, increasing manufacturing costs and reducing yield. Additionally, organic insulating membranes with cyclic olefin resin have insufficient heat resistance, causing voids during bonding and annealing.

Innovation Solution

A hybrid bonding insulating membrane forming material comprising a polyimide precursor with polymerizable unsaturated bonding sites, a solvent, and an oxime-based photopolymerization initiator. This material provides excellent exposure sensitivity and suppresses void formation during joining.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If inorganic insulating membranes are used for C2W hybrid bonding, then manufacturing precision and heat resistance are improved, but foreign matter adhesion causes voids at joint interface, reducing yield and increasing costs

Engineering Contradiction:

Improvebonding alignment precisionVSAvoidjoint interface quality

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent uses a composite material consisting of polyimide resin (organic component) and silica particles (inorganic component). This composite structure combines the low bonding temperature and flexibility of organic materials with the heat resistance and mechanical strength of inorganic materials, achieving both precise bonding alignment and void-free joint interfaces

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent changes the material parameters by incorporating silica particles into the polyimide resin matrix. This modification enhances the heat resistance and mechanical properties of the organic insulating membrane, allowing it to maintain structural integrity and prevent void formation during high-temperature bonding and annealing processes

Inventive Principle:

Principle #35Parameter changes

2Temperature

If cyclic olefin resin is used for organic insulating membrane, then bonding temperature is lowered, but heat resistance is insufficient causing voids during bonding and annealing

Engineering Contradiction:

Improvebonding temperatureVSAvoidheat resistance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent creates a composite material where polyimide resin serves as the base matrix and silica particles are dispersed within it. This composite structure allows the material to maintain low bonding temperature capability from the polyimide while gaining enhanced heat resistance from the silica particles, preventing void formation during annealing

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies local quality enhancement by distributing silica particles throughout the polyimide resin matrix. The silica particles are strategically positioned to provide localized heat resistance reinforcement at critical areas, allowing the material to withstand high-temperature annealing without forming voids while maintaining overall flexibility and low bonding temperature

Inventive Principle:

Principle #3Local quality

3Temperature

If inorganic materials are used for insulating film, then heat resistance is improved, but foreign matter generation requires clean room equipment, increasing manufacturing costs

Engineering Contradiction:

Improveheat resistanceVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent uses a composite material approach where polyimide resin (organic, low-cost, easy to process) is combined with silica particles (inorganic, heat-resistant). This allows the insulating film to achieve heat resistance comparable to purely inorganic materials while maintaining the ease of manufacturing and lower costs associated with organic polymer-based films

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent employs polyimide resin as a cost-effective organic matrix that can be easily processed and applied. While polyimide itself is not disposable, its low cost and ease of processing replace the need for expensive inorganic material processing equipment and clean room facilities, effectively reducing manufacturing costs while achieving sufficient heat resistance through silica particle reinforcement

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The material effectively suppresses void formation at the joint interface, improving semiconductor device manufacturing yield and reducing costs by enhancing the exposure sensitivity and heat resistance of the insulating membrane.

Implementation Method 1

a (C) oxime-based photopolymerization initiator

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

a (A) polyimide precursor having a polymerizable unsaturated bonding site

Methodology Applied

Scientific EffectPolymerization: Photopolymerisation

Data Source

PatentUS20250201760A1Hybrid bonding insulation membrane forming material, method of producing semiconductor device and semiconductor device

Publication Date: 2025.06.19 HD MICROSYSTEMS LTD

AI summary

A hybrid bonding insulating membrane forming material includes: a (A) polyimide precursor having a polymerizable unsaturated bonding site; a (B) solvent; and a (C) oxime-based photopolymerization initiator.