UV-Cleavable Release Layer for Thick Substrate Separation
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Solution Overview
Problem
Existing methods for separating a device substrate from a carrier substrate in semiconductor device fabrication are inefficient and require multiple processes, particularly when dealing with thick release layers, which can reduce fabrication efficiency.
Innovation Solution
A method involving a release layer composed of an aromatic polymerization unit and a siloxane polymerization unit, where the aromatic unit is decomposed by ultraviolet light and the siloxane unit is decomposed by a cleansing agent, allowing for simplified separation of the carrier substrate, followed by a cleaning process to expose the device substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thick release layer is used to attach the device substrate to the carrier substrate, then the attachment strength is improved, but the separation process becomes more complex and time-consuming
Solution Approach 1:
The release layer is segmented into two distinct functional units: an aromatic polymerization unit that provides UV-responsive decomposition and a siloxane polymerization unit that provides cleansing agent-responsive decomposition. This segmentation allows the thick release layer to be removed in two separate, simplified stages rather than requiring complex multi-step processes, thereby maintaining attachment strength while reducing separation process complexity
Solution Approach 2:
The release layer utilizes parameter changes in response to different stimuli: UV irradiation triggers decomposition of the aromatic polymerization unit, and subsequent cleansing agent application triggers decomposition of the siloxane polymerization unit. This dual-parameter approach enables efficient removal of thick release layers through controlled chemical changes rather than mechanical or thermal processes, reducing both process complexity and time
2Reliability
If a thick release layer is used to ensure proper attachment, then the attachment reliability is improved, but the fabrication time increases
Solution Approach 1:
The release layer is pre-configured with two distinct decomposition mechanisms before the attachment process begins. The aromatic polymerization unit is designed to decompose upon UV irradiation, and the siloxane polymerization unit is designed to decompose upon cleansing agent exposure. This preliminary action ensures that the thick release layer can be reliably removed through predetermined, efficient pathways, maintaining attachment reliability while minimizing fabrication time
Solution Approach 2:
The removal of the thick release layer is achieved by substituting mechanical or thermal separation methods with chemical decomposition processes. UV irradiation induces photodecomposition of the aromatic unit, and cleansing agents induce chemical decomposition of the siloxane unit. This substitution enables rapid, controlled removal of thick release layers without the time-consuming mechanical scraping or heating processes, thereby reducing fabrication time while maintaining reliability
3Ease of manufacture
If a simple release layer composition is used, then the ease of manufacture is improved, but the separation efficiency decreases
Solution Approach 1:
The release layer employs a composite material structure combining aromatic polymerization units and siloxane polymerization units in a single layer. This composite approach integrates two distinct chemical functionalities that respond to different stimuli (UV light and cleansing agents), enabling efficient separation through a simplified two-step process. The composite structure maintains ease of manufacture as a single layer while achieving high separation efficiency through the synergistic combination of different decomposition mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient separation of the carrier substrate, reducing the time and complexity of the fabrication process while maintaining high fabrication efficiency, even with thicker release layers, and allows for further processing into semiconductor devices.
Implementation Method 1
irradiating the carrier substrate with an ultraviolet ray to separate the carrier substrate from the release layer
Implementation Method 2
a siloxane polymerization unit that is decomposed by the cleansing agent
Data Source
AI summary
Disclosed are methods of fabricating semiconductor devices and methods of separating substrates. The semiconductor device fabricating method comprises providing a release layer between a carrier substrate and a first surface of a device substrate to attach the device substrate to the carrier substrate, irradiating the carrier substrate with an ultraviolet ray to separate the carrier substrate from the release layer and to expose one surface of the release layer, and performing a cleaning process on the one surface of the release layer to expose the first surface of the device substrate. The release layer includes an aromatic polymerization unit and a siloxane polymerization unit.