UV-Cured Temporary Bonding Composition for Thin Substrate Release
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Solution Overview
Problem
Existing temporary bonding agents for thin substrates in electronic device manufacturing fail to provide adequate heat resistance and tape release properties, leading to substrate breakage during the release process, especially with substrates thinner than 70 μm.
Innovation Solution
A composition for temporary bonding comprising bifunctional (meth)acrylates with cyclic structures and a photo radical polymerization initiator, formulated to have a storage modulus of 0.66 GPa or less, which is cured using UV-LED at specific intensity and wavelength, enhancing heat resistance and tape release properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If organic resin film is used for the substrate of the protective tape, then the tape is flexible, but the strength and heat resistance are insufficient
Solution Approach 1:
The patent uses a composite structure consisting of a glass substrate (providing strength and heat resistance) combined with a release coating layer (providing flexibility and release properties). This composite material approach allows the protective tape to simultaneously achieve high strength, heat resistance up to 400°C or higher, and flexibility for easy application and removal.
2Reliability
If adhesive bonding is used to bond the substrate to the support, then durability is sufficient for high temperature treatment, but the substrate cannot be easily released from the support
Solution Approach 1:
The patent employs a release coating layer with dynamically adjustable bonding characteristics. The coating allows strong bonding during high temperature treatment (maintaining durability) but enables easy release afterward through laser irradiation or peeling force, achieving both strong adhesion and easy release properties.
Solution Approach 2:
The release coating layer utilizes phase transition or chemical bond breaking under laser irradiation to transition from a bonded state to a released state. The laser energy causes the coating material to decompose or change phase, breaking the bond between substrate and support while leaving the substrate intact.
3Reliability
If the temporary bonding agent has high adhesive strength to bond substrate and support, then durability is sufficient for subsequent steps, but the tape breaks when releasing the tape
Solution Approach 1:
The patent creates different local properties within the bonding system: the release coating layer has low strength at the interface with the support (enabling easy release) while maintaining sufficient bonding to the substrate. The glass substrate itself provides high strength to prevent tape breakage during release, localizing the weak bonding only where needed at the support interface.
4Ease of operation
If conventional temporary bonding agents are used, then ease of release is achieved, but heat resistance is insufficient for high temperature treatment
Solution Approach 1:
The patent combines glass substrate material (providing heat resistance up to 400°C or higher) with a release coating layer (providing ease of release). This composite structure maintains thermal stability during high temperature treatment while preserving release functionality through laser irradiation or mechanical peeling after the thermal process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition ensures reliable tape release without breaking, maintaining substrate integrity and enabling high-temperature processing, suitable for thin substrates down to 50 μm thickness.
Implementation Method 1
a photo radical polymerization initiator, and wherein a cured body of the composition has a storage modulus at 23° C. of 0.66 GPa or less, wherein the cured body is prepared by sandwiching the composition for temporary bonding between PET films, pressing out the composition to make a thickness down to 50 μm, and curing the composition in a condition of an integrated light intensity of 5,000 mJ/cm2 using UV-LED
Data Source
AI summary
A composition for temporary bonding, comprising:(A) a bifunctional (meth)acrylate having a cyclic structure; and(B) a photo radical polymerization initiator,wherein a cured body of the composition has a storage modulus at 23° C. of 0.66 GPa or less, andwherein the cured body is prepared by sandwiching the composition for temporary bonding between PET films, pressing out the composition to make a thickness down to 50 μm, and curing the composition in a condition of an integrated light intensity of 5,000 mJ/cm2 using UV-LED (central wavelength 405 nm, intensity 100 mW/cm2).