Pressure-Sensitive Adhesive Sheet for Secure Transfer and Easy Pickup
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Solution Overview
Problem
Existing pressure sensitive adhesive sheets struggle to balance the firm holding of semiconductor elements during transfer to prevent displacement, while also allowing easy pickup after treatment, which is crucial for miniaturized semiconductor devices.
Innovation Solution
A pressure sensitive adhesive sheet with a surface featuring unevenness and a complex shear elastic modulus of 0.001 MPa to 1.0 MPa at 23°C, allowing the sheet to deform and recover to firmly hold and easily release elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pressure sensitive adhesive sheet with high adhesion strength is used to firmly hold semiconductor elements during transfer, then element displacement is prevented, but element pickup becomes difficult after treatment
Solution Approach 1:
The adhesive sheet employs a reversible phase change mechanism that dynamically alters adhesion strength. Upon laser irradiation, the adhesive layer transitions from a high-adhesion state to a low-adhesion state, enabling automatic switching between firm holding and easy pickup without manual intervention
Solution Approach 2:
The adhesive layer utilizes phase transition (solid-gel or glass transition) induced by laser heating to modulate adhesion properties. The phase change causes abrupt reduction in adhesion strength, allowing elements to be firmly held during transfer and easily released after treatment
2Manufacturing precision
If the adhesive sheet is made soft to easily deform and hold elements, then positioning precision is improved, but structural stability deteriorates
Solution Approach 1:
The adhesive layer's physical parameters (viscosity, elasticity) are dynamically changed through temperature control. During element placement, the material is in a soft, deformable state for precise positioning; after placement, temperature reduction restores structural stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive sheet effectively secures elements during transfer and treatment, facilitating precise positioning and easy removal, enhancing the manufacturing process of miniaturized semiconductor devices.
Implementation Method 1
the pressure sensitive adhesive layer has unevenness on a surface and has a complex shear elastic modulus at 23° C. of 0.001 MPa or greater and 1.0 MPa or less
Implementation Method 2
promoting separation of the element from the pressure sensitive adhesive sheet by allowing the plurality of protruded portions deformed to be recovered to a protruded shape by an external stimulus
Data Source
AI summary
A pressure sensitive adhesive sheet includes a pressure sensitive adhesive layer catching elements distant from a holding substrate. The pressure sensitive adhesive layer has unevenness on a surface and having a complex shear elastic modulus at 23° C. of 0.001 MPa or greater and 1.0 MPa or less.