Solvent-Free Adhesive Composition Without Inorganic Fillers
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Solution Overview
Problem
Hot melt-type adhesive compositions with reduced residual solvent face productivity issues due to inorganic fillers obstructing coating machine filters and outlets.
Innovation Solution
An adhesive composition using an olefin-based polymer as a raw material, without inorganic fillers, to achieve excellent self-adhesiveness and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If inorganic fillers are added to hot melt adhesive composition, then self-adhesive force is improved, but coating machine filters and outlets are obstructed
Solution Approach 1:
The patent removes inorganic fillers from the adhesive composition entirely, extracting the problematic component that caused filter obstruction while maintaining the essential adhesive functionality through organic polymer selection and formulation adjustments
Solution Approach 2:
The patent changes the compositional parameters by specifying precise ranges for polymer content (70-95 mass%), plasticizer content (5-30 mass%), and molecular weight parameters (Mw and Mn), transforming the formulation from one containing inorganic fillers to a solvent-free organic-based composition with optimized rheological properties
2Strength
If solvent-type adhesive is used, then self-adhesive force is improved, but drying time increases and residual solvent remains
Solution Approach 1:
The patent utilizes the phase transition from liquid solvent-based adhesive to solid hot melt adhesive, eliminating the need for evaporation-based drying while maintaining adhesive performance through controlled cooling and solidification of the polymer matrix
Solution Approach 2:
The patent changes the fundamental parameter of solvent content from high (in solvent-type adhesives) to zero (in this hot melt composition), replacing the solvent's function with carefully selected plasticizers and polymer formulations that provide comparable flexibility and adhesion without requiring drying time
Data Source
AI summary
Provided is an adhesive composition that does not contain a solvent and that is excellent in productivity and self-adhesiveness. The object is attained by an adhesive composition containing an olefin-based polymer, in the adhesive composition, no inorganic particles being blended, and the adhesive composition having a storage modulus at 20°C of 0 to 1.0×107 Pa, and a storage modulus at 40°C of 5.3×105 Pa to 1.0×109 Pa.