Non-Macromolecular Adhesive Additives TRIZ Cases

A one-part polythiol sealant composition uses a photolatent base and phase-separated amine to enable on-demand curing.

A pH buffer mediates silicone powder effects to resolve the contradiction between cured material flexibility and preservation stability.

A modified epoxy resin composition reduces thermal expansion through controlled curing-induced phase separation.

Conductive silicone adhesive integrates welding and damping to eliminate separate noise reduction treatments.

High-melt-viscosity resin withstands warping stress to prevent detachment of thin semiconductor layers during three-dimensional NAND memory device assembly.

A single-part cyanoacrylic adhesive blends silyl polymers and elastomers to deliver flexible bonding without complex two-part mixing.

A light-reflective anisotropic conductive adhesive incorporates insulating particles to reflect emitted light within the device structure.

A conductive adhesive layer bonds flexible display substrates while providing electrical conductivity for electromagnetic interference shielding.

Replacing long alkyl tin catalysts with dimethyl tin variants enables strong adhesion to poorly adhesive coated plates while maintaining storage stability.

Nano-fillers act as spacers between two-dimensional carbon layers in a composite adhesive, preventing agglomeration and increasing conductivity paths.

Segmenting phase-change materials into 100-200 nm capsules resolves compatibility issues in polyurethane adhesives while maintaining thermal conductivity.

A gas barrier pressure-sensitive adhesive sheet with a specific storage modulus prevents delamination at layer interfaces.

Optimized filler dispersion resolves the trade-off between thermal conductivity and adhesive strength in battery pack bonding.

A photocurable temporary bonding composition uses controlled viscosity and specific gravity to suppress backflow during spin coating.

An aerogel-based layer combines silicone binder with porous particles to enhance thermal conductivity.

A curable polysilsesquioxane compound with specific 29Si NMR peaks provides high adhesion and heat resistance.

A core-sheath filament deposits a polyisobutylene adhesive core through a non-tacky sheath.

Zinc particles dissolve into the silver matrix during curing, resolving the trade-off between thermal conductivity and adhesive force on gold-coated surfaces.

Organoborane amine complex initiates acrylic polymerization in two-component adhesives, creating homogeneous networks that bond low surface energy substrates.

A 2-cyanoacrylate adhesive composition incorporates a specific onium salt to enhance adhesion rates on metals and low-polarity thermoplastic elastomers.

A hot melt adhesive composition balances cohesive strength and low surface tack to bond plastic containers securely.

Coating hollow microspheres with 80 to 90 percent aluminum trihydroxide reduces flammability without increasing viscosity.

A curable composition uses oxide-containing complexes to form a cured material with enhanced resilience and light transmittance.

A hot melt adhesive composition using olefin polymers and fatty acids to join paper substrates.

A methacrylic copolymer adhesive film achieves high elongation through specific crosslinking and coupling agents.

A room temperature curable resin composition incorporates an organosilicon compound featuring a hindered amine skeleton to suppress ultraviolet degradation.

UV curable adhesive cures through low-transmittance substrates to resolve weak adhesion and air bubble defects in thin touch sensors.

Boron nitride coated carbon particles in adhesive compositions prevent electrical short circuits while maintaining high thermal conductivity.

Removing inorganic fillers from an olefin-based adhesive prevents coating machine obstruction while preserving self-adhesiveness.

Low hydroxyl dibenzoate plasticizer improves polyurethane mechanical strength while preventing exudation and yellowing.

Curable hybrid resin composition provides tack to wood particle mats, preventing breakage in isocyanate-based NAF manufacturing.

A photocurable adhesive film uses isobutylene-isoprene rubber with acrylic acid ester groups to form a chemically cross-linked network.

A copolymer adhesive network with conductive particles delivers stable electrical conductivity.

A multilayer adhesive sheet uses a silicone polymer and photopolymerization initiator to enable controlled separation of the die attach film.

Corona treatment polarizes the surface to bond ink without sealing pores, resolving breathability trade-offs.

An optimized thermosetting adhesive sheet reduces wafer warping and chipping during dicing by contracting and flattening the substrate.

Mechanical compression contracts thermoplastic pipes before wrapping with continuous fiber tapes, eliminating cooling energy for high-pressure transport.

Carbodiimide reacts with polyester carboxyl groups to prevent hydrolysis, maintaining adhesive strength under high temperature and humidity.

Optical matching glue fills intervals between substrate and sensing layer electrodes to reduce display defects.

A layered body uses a composite resin containing polysiloxane segments bonded to vinyl-based polymers and fine inorganic particles.

Catechol-functionalized adhesive self-polymerizes via oxidation to resolve poor interfacial adhesion caused by water wicking.

A polyurethane adhesive composition combines epoxy resin and aliphatic amine crosslinker to form a stable aqueous mixture.

Fluorescent dyes allow UV or IR inspection of non-chromated primer uniformity without compromising corrosion inhibition.

A hot melt adhesive composition blends low molecular weight semicrystalline and high molecular weight amorphous single-site catalyst polypropylenes.

Modified polyolefin and solid phenol resin composition achieves rapid adhesive bonding at 100 to 200 degrees Celsius without special storage conditions.

Epoxy adhesive composition disperses core-shell rubber particles in the resin matrix to maintain adhesion and impact strength from -40°C to 80°C.

A thermochromic sealant cures via color change during UV treatment, enabling a narrow frame display panel design.

A rubber composition with amine salts and water-carrying substances bonds to fluorine-contained polymers.

A solvent-free polyurethane adhesive composition uses ethylene oxide end-capped polyols to deliver rapid initial cure rates.

Adhesive hydrogel medical electrode reduces contact resistance and noise, enabling stable fetal heart rate signal measurements despite terminal wobble.