Heat-Curable Resin Composition for Semiconductor Lamination
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Solution Overview
Problem
Semiconductor elements in three-dimensional NAND memory devices are prone to warpage due to their complicated circuit layers and thin semiconductor layers, leading to detachment issues during the lamination process.
Innovation Solution
A heat-curable resin composition with a melt viscosity of 3100 Pa·s or higher at 120° C. is used, combined with a dicing/die-bonding integrated film, to provide a strong adhesive force that withstands warping stress, ensuring stable lamination of semiconductor elements without detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor elements with complicated circuit layers and thin semiconductor layers are used to increase device capacity, then device capacity is improved, but warpage occurs leading to detachment during lamination
Solution Approach 1:
The patent changes the viscosity parameter of the adhesive resin composition to 3100 Pa·s or higher at 120°C, which provides sufficient adhesion strength to counteract warpage forces while maintaining proper wetting and bonding characteristics during the lamination process
Solution Approach 2:
The patent uses a composite adhesive resin composition containing epoxy resin, phenolic resin, and high molecular weight component in specific ratios, creating a material that combines the strengths of each component to achieve both high adhesion and warpage resistance
2Reliability
If adhesive resin with high viscosity is used to resist warping stress, then detachment is suppressed, but manufacturing process complexity increases
Solution Approach 1:
The patent specifies precise viscosity parameters (3100 Pa·s or higher at 120°C) and compositional ratios for the adhesive resin, transforming a complex material selection problem into a controlled parameter optimization that achieves detachment resistance through quantifiable specifications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively suppresses detachment between adjacent semiconductor elements, enhancing the reliability and stability of the lamination process in semiconductor device manufacturing.
Implementation Method 1
a step of heat-curing the film-shaped adhesive
Data Source
AI summary
A method for manufacturing a semiconductor device according to an aspect of the present disclosure includes a step of preparing a dicing/die-bonding integrated film including an adhesive layer formed of a heat-curable resin composition having a melt viscosity of 3100 Pa·s or higher at 120° C., a tacky adhesive layer, and a base material film; a step of sticking a surface on the adhesive layer side of the dicing/die-bonding integrated film and a semiconductor wafer together; a step of dicing the semiconductor wafer; a step of expanding the base material film and thereby obtaining adhesive-attached semiconductor elements; a step of picking up the adhesive-attached semiconductor element from the tacky adhesive layer; a step of laminating this semiconductor element to another semiconductor element, with the adhesive interposed therebetween; and a step of heat-curing the adhesive.