Aerogel-Based Layer Thermal Conductivity and Flexibility
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Solution Overview
Problem
Existing adhesives, composite materials, and adhesive tapes lack improved thermal conductivity and flexibility, making them inadequate for various applications requiring these properties.
Innovation Solution
An aerogel-based layer is developed, comprising a silicone-based binder component at 10-90 wt.% and an aerogel component at 10-90 wt.%, which can be integrated into composite materials and adhesive tapes to enhance thermal conductivity and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional adhesives and composite materials are used, then ease of manufacture is maintained, but thermal conductivity and flexibility are insufficient
Solution Approach 1:
The patent employs composite materials by combining aerogel particles with silicone-based binder components to create an aerogel-based layer. This composite structure integrates the superior thermal insulation properties of aerogel with the flexibility and adhesion characteristics of silicone, achieving improved thermal conductivity while maintaining ease of manufacture through a straightforward mixing and coating process
2Temperature
If aerogel content is increased to improve thermal conductivity, then thermal performance improves, but flexibility and processability deteriorate
Solution Approach 1:
The patent applies parameter changes by systematically varying the weight ratio of aerogel component to silicone-based binder component (within 10-90 wt% ranges) to optimize both thermal conductivity and flexibility. This parameter optimization allows the formulation to achieve desired thermal performance while maintaining adequate flexibility and processability for practical applications
Solution Approach 2:
The patent utilizes porous materials by incorporating aerogel particles, which possess an ultra-light, highly porous structure with exceptional thermal insulation properties. The porous nature of aerogel provides high thermal resistance while the fine particle morphology allows good dispersion in the binder, maintaining flexibility even at high aerogel loadings
3Temperature
If aerogel-based layer is designed for high thermal conductivity, then thermal performance improves, but shrinkage resistance at high temperature worsens
Solution Approach 1:
The patent employs the silicone-based binder component as an intermediary material that bridges the aerogel particles and provides thermal stability. The silicone binder acts as a matrix that holds the aerogel structure together at high temperatures, preventing excessive shrinkage while allowing the aerogel to provide thermal insulation. This intermediary role of the binder resolves the contradiction between thermal performance and dimensional stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The aerogel-based layer achieves improved thermal conductivity and flexibility, making it suitable for a wide range of applications, while maintaining a shrinkage rating of not greater than 10% at 1000°C.
Implementation Method 1
an aerogel component at a content of at least about 10 wt. % and not greater than about 90 wt. % for a total weight of the aerogel-based layer
Implementation Method 2
a silicone-based binder component at a content of at least about 10 wt. % and not greater than about 90 wt. % for a total weight of the aerogel-based layer
Data Source
AI summary
The present disclosure relates to an aerogel-based layer may include a silicone-based binder component at a content of at least about 10 wt. % and not greater than about 90 wt. % for a total weight of the aerogel-based layer, and an aerogel component at a content of at least about 10 wt. % and not greater than about 90 wt. % for a total weight of the aerogel-based layer.


