Graphene Composite Conductive Ink Agglomeration Control
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Solution Overview
Problem
Conductive silver adhesives are costly, and existing conductive carbon adhesives face issues with stacking and agglomeration of two-dimensional carbon materials, limiting their conductivity and dispersibility.
Innovation Solution
A three-dimensional conductive carbon adhesive is formulated using two-dimensional carbon materials and nano-fillers like alumina, boron nitride, and titanium dioxide, mixed with a small-type powder mixer and added to polymer glue, then cured using UV radiation or an oven to prevent agglomeration and enhance conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive carbon adhesive is formulated using two-dimensional carbon materials, then conductivity is improved, but stacking and agglomeration of the 2D carbon material occurs, reducing dispersibility
Solution Approach 1:
The patent combines two-dimensional carbon materials with three-dimensional filler particles (alumina, boron nitride, or titanium dioxide) to create a composite conductive adhesive formulation. The 3D filler particles act as spacers that prevent the 2D carbon layers from stacking and agglomerating, thereby maintaining both high conductivity and good dispersibility simultaneously
Solution Approach 2:
The patent introduces nano-sized filler particles at specific locations within the adhesive formulation to locally prevent stacking of carbon materials. These filler particles are distributed throughout the adhesive to create localized spacing that prevents agglomeration while preserving the conductive network
2Reliability
If conductive silver adhesive is used to achieve good conductivity, then conductivity is improved, but cost increases significantly
Solution Approach 1:
The patent replaces expensive conductive silver adhesive with a cost-effective conductive carbon-based adhesive formulation. By using abundant carbon materials combined with inexpensive nano-fillers (alumina, boron nitride, or titanium dioxide), the patent achieves comparable conductivity performance at a fraction of the cost of silver-based adhesives
3Reliability
If 2D carbon material is used in conductive adhesive, then conductivity paths are increased, but agglomeration occurs, limiting the effectiveness
Solution Approach 1:
The patent introduces three-dimensional filler particles as intermediary elements between the two-dimensional carbon materials. These filler particles act as physical barriers and spacers that prevent direct contact and stacking of carbon layers, thereby eliminating agglomeration while preserving the increased conductivity paths provided by the 2D materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach effectively increases the number of conductivity paths and improves the dispersibility of two-dimensional carbon materials, reducing sheet resistance and enhancing the performance of the conductive adhesive.
Implementation Method 1
exposing to Ultraviolet (UV) radiation
Implementation Method 2
putting into an oven
Data Source
AI summary
Conductive carbon adhesive is an active technology researched in the world, and its application is quite wide, such as liquid crystal display (TFTLCD), organic light emitting diode (OLED), radio frequency identification system (RFID), antenna, solar cell, sensing and electronic components for devices. Since the two-dimensional carbon material used for the conductive carbon adhesive is easily stacked and agglomerated in the polymer, the present invention adds nano-fillers to the carbon material to prepare a three-dimensional conductive carbon adhesive to prevent carbon material agglomeration.