Curable Adhesive Flexibility Stability via pH Buffer

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Solution Overview

Problem

Adhesives containing ene and thiol compounds face a challenge in maintaining preservation stability while achieving high flexibility, particularly in applications like camera modules where impact resistance is crucial, as the addition of silicone powder to enhance flexibility often compromises storage stability.

Innovation Solution

A curable composition comprising an ene compound, a thiol compound, a stabilizer, a filler with silicone powder, and a microencapsulated curing catalyst, which balances flexibility and preservation stability by using a microencapsulated curing catalyst to mitigate the negative effects of silicone powder on storage stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If silicone powder is added to enhance flexibility, then flexibility is improved, but preservation stability deteriorates

Engineering Contradiction:
ImproveflexibilityVSAvoidpreservation stability
Core Design Contradiction:
ShapeVSStability of the object's composition

Solution Approach 1:

A pH buffer is introduced as an intermediary substance to mediate between the silicone powder and the curable composition. The pH buffer maintains the pH within 5-8, preventing the silicone powder from adversely affecting preservation stability while allowing the composition to remain highly flexible. This intermediary component resolves the contradiction by isolating the harmful pH influence of silicone powder.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The pH parameter of the curable composition is actively controlled and adjusted to within the range of 5-8 using a pH buffer. By changing and maintaining this specific parameter, the composition achieves both high flexibility (from silicone powder) and improved preservation stability (from controlled pH), thereby resolving the technical contradiction.

Inventive Principle:
Principle #35Parameter changes

2Shape

If ene compound and thiol compound are used for curing, then flexibility of cured material is improved, but preservation stability may be impaired

Engineering Contradiction:
Improveflexibility of cured materialVSAvoidpreservation stability of curable composition
Core Design Contradiction:
ShapeVSStability of the object's composition

Solution Approach 1:

The pH buffer serves as a protective intermediary between the curable components (ene and thiol compounds) and the silicone powder. It prevents adverse interactions during storage while allowing the ene-thiol curing system to produce highly flexible cured materials, thus resolving the contradiction between flexibility and preservation stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

By controlling the pH parameter within 5-8 using a buffer system, the curable composition maintains stability during storage while preserving the ability of the ene-thiol system to cure into flexible materials. This parameter control resolves the contradiction by creating optimal conditions for both storage stability and final flexibility.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves highly flexible cured materials with improved preservation stability, suitable for applications requiring impact resistance and long-term storage, such as camera modules, by using a microencapsulated curing catalyst to manage the pH influence of silicone powder.

Implementation Method 1

anion polymerization initiator (D) which contains a microencapsulated curing catalyst (D1)

Methodology Applied
Scientific EffectAnion polymerization:

Implementation Method 2

anion polymerization initiator (D) which contains a microencapsulated curing catalyst (D1)

Methodology Applied
Scientific EffectMicroencapsulation:

Implementation Method 3

curable component (A) including an ene compound (A1) and a thiol compound (A2)

Methodology Applied
Scientific EffectEne-thiol addition reaction: Chemical Bonding

Data Source

PatentUS20240360281A1Curable composition and adhesive
Publication Date: 2024.10.31 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A curable composition according to the present disclosure contains: a curable component (A) including an ene compound (A1) and a thiol compound (A2); a filler (C); and an anion polymerization initiator (D). The filler (C) contains silicone powder (C1). The anion polymerization initiator (D) contains a microencapsulated curing catalyst (D1).