Curable Polysilsesquioxane for Optical Device Sealing
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Solution Overview
Problem
Current optical device-securing materials with polysilsesquioxane compounds fail to produce cured products that exhibit sufficient heat resistance and delamination resistance while maintaining adhesion, leading to potential cracks and delamination issues due to high-energy light and high-temperature exposure.
Innovation Solution
A curable polysilsesquioxane compound with a specific 29Si nuclear magnetic resonance spectrum, featuring a first peak top within −73 ppm to −65 ppm and a second peak top within −82 ppm to −73 ppm, and a mass average molecular weight of 800 to 5,000, which is produced through polycondensation using a polycondensation catalyst and a silane coupling agent, resulting in a composition that provides high adhesion, heat resistance, and delamination resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a polysilsesquioxane compound is used as the main component of an optical device-securing composition, then adhesion is improved, but heat resistance and delamination resistance deteriorate under high-temperature exposure
Solution Approach 1:
The invention changes the chemical structure parameters of the polysilsesquioxane compound by introducing specific structural units (Formula 1: R3SiO2.5-DR1X0 and Formula 2: R2SiO3/2) with controlled ratios. The key parameter change is the introduction of R1X0 groups (where X0 is a halogen atom, cyano group, or protected hydroxyl group) at specific positions in the molecular structure, which fundamentally alters the curing behavior and thermal properties of the compound.
Solution Approach 2:
The invention creates a composite molecular structure within the polysilsesquioxane compound by combining different structural units (Formula 1 and Formula 2) in specific ratios. This composite approach allows the material to exhibit both the adhesion properties of polysilsesquioxane and the heat resistance of crosslinked networks, resolving the contradiction between adhesion and heat resistance.
2Reliability
If the polysilsesquioxane compound is cured under high-energy light exposure, then bonding is achieved, but cracks and delamination occur due to insufficient heat resistance
Solution Approach 1:
The invention changes the chemical composition parameters by incorporating R1X0 groups that enable dual-curing mechanisms. The compound can be cured by both high-energy light (through photoinitiated polymerization of vinyl or other reactive groups) and moisture (through silane hydrolysis and condensation), creating a more robust crosslinked network that resists cracking and delamination under thermal stress.
Solution Approach 2:
The R1X0 structural units act as intermediaries that bridge the gap between light-curing and heat resistance requirements. These groups enable the formation of a dual-crosslinked network structure that provides both rapid initial bonding through light curing and long-term stability through moisture-cured crosslinking, preventing cracks and delamination.
3Reliability
If the polysilsesquioxane compound structure is modified to improve heat resistance, then delamination resistance improves, but adhesion to substrates deteriorates
Solution Approach 1:
The invention applies local quality by placing different functional groups at specific locations within the molecular structure. The R1X0 groups are positioned at the periphery of the polysilsesquioxane cage structure, where they can provide both adhesion functionality (through reactive groups like vinyl, cyano, or protected hydroxyl) and heat resistance (through crosslinking capability), allowing different parts of the molecule to fulfill different functions simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable polysilsesquioxane compound and composition effectively produce a cured product with high adhesion and resistance to heat and delamination, reducing the likelihood of cracks and ensuring long-term sealing of optical devices under high-energy light and high-temperature conditions.
Implementation Method 1
the curable polysilsesquioxane compound having a 29Si nuclear magnetic resonance spectrum that has a first peak top within the range of −73 ppm or more and less than −65 ppm, has a second peak top within the range of −82 ppm or more and less than −73 ppm
Implementation Method 2
a curable polysilsesquioxane compound including at least one structural unit represented by CHR1X0-D-SiO3/2, and having a 29Si nuclear magnetic resonance spectrum
Data Source
AI summary
The present invention is a curable polysilsesquioxane compound comprising at least one structural unit represented by CHR1X0-D-SiO3/2,the curable polysilsesquioxane compound having a 29Si nuclear magnetic resonance spectrum that has a first peak top within a range of −73 ppm or more and less than −65 ppm, has a second peak top within a range of −82 ppm or more and less than −73 ppm, and substantially does not have a peak within a range of −65 ppm or more and less than −55 ppm, anda method for producing the curable polysilsesquioxane compound, anda curable composition comprising the curable polysilsesquioxane compound and a silane coupling agent, anda cured product obtained by heating the curable composition, anda method for using the curable polysilsesquioxane compound or the curable composition, as an optical device-securing material.