Core-Sheath Filament Adhesive for Complex Substrates
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Solution Overview
Problem
Traditional adhesive transfer tapes require die-cutting, leading to waste and limitations in applying adhesives to complex or irregular surfaces, and they often necessitate the use of release liners, which are not ideal for precise or intricate applications.
Innovation Solution
The development of core-sheath filaments with a non-tacky sheath and an adhesive core, where the sheath has a low melt flow index and the core is a polyisobutylene polymer, allowing for precise deposition and handling without the need for release liners or die-cutting, enabling printing on thin or complex substrates with reduced waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If adhesive transfer tapes are used, then adhesive application is simple, but die-cutting is required leading to waste and limitations in applying to complex surfaces
Solution Approach 1:
The invention changes the physical state and delivery form of the adhesive from pre-cut tape to a dispensable hot-melt composition delivered through a nozzle, eliminating the need for die-cutting and enabling application to complex surfaces
Solution Approach 2:
A non-tacky sheath material serves as an intermediary that encapsulates the adhesive core, allowing the adhesive to be handled and dispensed without premature adhesion, replacing the function of release liners
2Ease of operation
If release liners are used with adhesive tapes, then adhesive handling is easier, but precise or intricate applications are limited
Solution Approach 1:
The invention extracts the adhesive from the tape format and delivers it directly through a nozzle as a hot-melt composition, eliminating release liners entirely and enabling precise control for intricate applications
Solution Approach 2:
The invention replaces the mechanical tape-and-liner system with a thermal processing system where the adhesive is melted, dispensed, and applied with precision control
3Ease of manufacture
If traditional adhesive tapes are used, then adhesive delivery is straightforward, but application to thin or complex substrates is difficult
Solution Approach 1:
The invention introduces dynamic control through programmable nozzle movement and temperature control, allowing the adhesive application process to adapt to complex substrate geometries and patterns
Solution Approach 2:
The invention changes the adhesive from a solid tape to a hot-melt composition that can be precisely controlled in terms of temperature, flow rate, and deposition pattern, enabling application to diverse substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a hot-melt processable adhesive system that can be used in FFF for precise and controlled adhesive placement on complex surfaces with minimal waste and no need for post-processing, offering high barrier properties and design flexibility.
Implementation Method 1
an adhesive core, wherein the adhesive core comprises: a polyisobutylene polymer having an average weight average molecular weight of 125000 grams per mole (g/mol) to 800000 g/mol
Implementation Method 2
a non-tacky sheath, wherein the non-tacky sheath exhibits a melt flow index of less than 15 grams per 10 minutes (g/10 min)
Implementation Method 3
providing a high barrier to air and moisture which is beneficial in many applications
Data Source
Figure 1~2
AI summary
Provided are amorphous polyolefin compositions that can be dispensed digitally as the core in a core-sheath construction. These formulations provide dependable adhesion to both polar and non-polar surface in addition to providing a high barrier to air and moisture which is beneficial in many applications. These formulations and the method of processing these formulations provide many benefits, including low VOCs, avoiding die cutting, design flexibility, achieving intricate nonplanar bonding patterns, printing on thin and/or delicate substrates, and printing on an irregular and/or complex topography, no need for release liners or low-adhesion backsize, and no need for a post-processing step.