Adhesive Composition for Organic Electronic Device Encapsulation
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Solution Overview
Problem
Organic electronic devices, such as OLEDs, are prone to durability issues due to oxidation from external factors like moisture, leading to defects like dark spots and reduced lifespan.
Innovation Solution
A curable adhesive composition with specific curable compounds, thermal and photo-initiators, and moisture adsorbents is applied as a sealant to form a top encapsulating layer, preventing moisture and oxygen ingress and ensuring the longevity of organic electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a liquid adhesive composition is applied to encapsulate the organic electronic device, then the encapsulation coverage is improved, but the composition may penetrate into cracks and cause dark spots
Solution Approach 1:
The patent applies a protective film on the electrode surface before applying the adhesive composition. This preliminary protective layer prevents the liquid adhesive from penetrating into cracks and causing dark spots, while still allowing the adhesive to properly encapsulate the device edges and surfaces.
2Reliability
If the adhesive composition is applied directly to the element surface, then the encapsulation is achieved, but chemical damage may occur to the element
Solution Approach 1:
The patent introduces a protective film as an intermediary layer between the electrode and the adhesive composition. This mediator prevents direct chemical interaction between the adhesive and the sensitive organic electronic elements, thereby preventing chemical damage while still enabling effective encapsulation.
3Area of stationary object
If the adhesive composition has high fluidity to ensure proper spreading, then the encapsulation coverage is improved, but penetration into cracks increases
Solution Approach 1:
The patent creates different functional zones: the protective film provides a barrier quality in areas where penetration would occur (cracks and defects), while the adhesive composition maintains its fluidity and spreading capability in areas where proper encapsulation is needed. This local differentiation of material properties resolves the contradiction between spreading and penetration prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition effectively blocks moisture and oxygen, enhancing the durability and preventing defects in organic electronic devices, thereby extending their lifespan and maintaining optical clarity.
Implementation Method 1
The adhesive composition may comprise a curable compound, a thermal initiator, and a photo-initiator
Implementation Method 2
The adhesive composition may comprise a curable compound, a thermal initiator, and a photo-initiator
Implementation Method 3
The curable compound may have no carbon-carbon unsaturated group
Data Source
AI summary
Disclosed is related to an adhesive composition for encapsulating an organic electronic element and an organic electronic device comprising the same. The adhesive composition includes a curable compound having no carbon-carbon unsaturated group, a thermal initiator, and a photo-initiator. The adhesive composition can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, can realize a top emitting organic electronic device, and can prevent defects such as dark spots which may occur in the organic electronic device.