Adhesive Member with Non-Uniform Conductive Ball Density for Display Pads
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Solution Overview
Problem
Existing display devices face challenges in ensuring reliable connections between circuit boards and display panels, particularly due to issues with conductive adhesive members that can lead to short circuits and reduced connection reliability.
Innovation Solution
The use of an adhesive member with a specific distribution of conductive balls, where the first conductive balls have a higher density over the first pad area and second conductive balls have a lower density over the second pad area, along with distinct gaps and widths, to enhance the reliability of connections between the display substrate and circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If uniform density conductive balls are used in the adhesive member, then the manufacturing process is simple, but short circuits may occur between pads and connection reliability is reduced
Solution Approach 1:
The adhesive member employs non-uniform conductive ball density distribution, with higher density in the first pad area and lower density in the second pad area. This local variation optimizes electrical connection reliability in different regions while preventing short circuits, directly resolving the contradiction between connection reliability and structural simplicity.
Solution Approach 2:
The adhesive member is divided into distinct regions with different conductive ball densities - a first pad area with higher density and a second pad area with lower density. This segmentation allows each region to be optimized for its specific function, improving overall connection reliability without requiring complete structural redesign.
2Reliability
If higher density conductive balls are used in the first pad area, then connection reliability is improved, but the complexity of controlling ball distribution increases
Solution Approach 1:
The patent specifies different density ranges for different pad areas - the first density is set at 50-150 balls/mm² while the second density is set at 10-50 balls/mm². This localized quality control allows manufacturing processes to target specific density requirements for each region, improving connection reliability while making the precision requirements more manageable through regional differentiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the reliability of connections by reducing the likelihood of short circuits and enhancing the connection reliability between the display panel and circuit board, ensuring stable operation of display devices.
Implementation Method 1
an adhesive member disposed between the display substrate and the circuit board and including an adhesive layer and a plurality of conductive balls distributed in the adhesive layer
Data Source
AI summary
A display device includes a display substrate including a plurality of first pads arranged in a first pad area and a plurality of second pads arranged in a second pad area, wherein the first pads and the second pads are arranged in different rows from each other, a circuit board including first circuit pads facing the first pads, respectively, and second circuit pads facing the second pads, respectively, and an adhesive member disposed between the display substrate and the circuit board and including an adhesive layer and a plurality of conductive balls distributed in the adhesive layer. Here, a first density of first conductive balls overlapping the first pad area among the conductive balls is greater that a second density of second conductive balls overlapping the second pad area among the conductive balls.