Flexible Printed Circuits TRIZ Cases

See how a printed strain sensor uses microscopic cracks in a sensing layer to detect breathing

Inclined connection pads with measurement pads improve film-to-panel alignment and strengthen display pad connections despite process errors.

A sliding hinge magnet placed close to the sensor improves fold-angle detection accuracy without adding gyro sensors or extra device thickness.

A stepped battery and bent display substrate share internal cavities to raise battery capacity and endurance without increasing device thickness.

A dual-branch sampling circuit board restores failed battery module sensing after fuse burnout, enabling quick repair and board reuse.

A bent rigid-flex circuit vertically aligns stacked dies to shorten connectors, cut attachment area, and simplify substrate interconnects.

Controlled spacing of antenna feed wirings preserves radiation and signal integrity while enabling reliable bonding in thin small-bezel displays.

Tear-line-adjustable positioning holes improve insulating film alignment on flexible circuits and help prevent leakage in cylindrical battery packs.

A stepped battery fits into a multi-level cavity beside a bent display substrate to raise capacity and endurance without adding bulk.

A nonconductive FPCB layer reinforces the radiating sheet and spreads heat across component regions to prevent damage and sustain performance.

Zigzag and widened straight fan-out wires plus a slit photomask balance resistance, cut dead space, and prevent opens and shorts.

Inclined measurement and dummy pads correct flex-film pitch variation, improving display panel bonding alignment and connection reliability.

Through-substrate holes and connected heat dissipation layers move chip heat outward in a flexible COF board, improving reliability.

Mounting COFs on both panel surfaces increases driver count without shrinking package spacing, enabling higher display resolution.

Targeted laser ablation removes particles and connecting-member material between display pads, preventing shorts and preserving signal transmission.

Variable-width zigzag and straight fan-out wires balance resistance for uniform luminance while reducing dead space and etching defects.

A removable memory PCB and connector let SSD capacity grow within the same form factor, avoiding full device replacement cost.

A wider flexible circuit tape with 60-99% outer-lead span supports more contacts, easing LED assembly and improving connection reliability.

Variable-width zigzag and straight data fan-out wires offset resistance differences, improving display luminance uniformity and reducing patterning defects.

Shock absorbers buffer flexible printed circuit boards to absorb vibration and impact, distribute stress, and reduce connector failure.

Multiple light sensors at different orientations let a foldable screen select an unshielded sensor for accurate ambient brightness adjustment.

Discrete binders and coupling members improve display panel flatness despite frame imperfections while enabling easier detachment and reassembly.

Overlapped FPCBs routed in one direction let dual camera modules share a compact housing while enabling separate replacement and simpler PCB connection.

A rigid-flex FPCB layout bends along multiple cover portions to save hinge space, reduce thickness, and keep foldable structures stable.

Impedance changes in segmented flexible PCB patterns enable accurate fold-angle detection and adaptive operating modes in foldable electronics.

Zigzag and widened fan-out wires plus slit photomask features offset resistance differences, keep luminance uniform, and reduce display dead space.

Holes and intersecting lines let this circuit board fold while preserving electrical continuity and supporting faster display operation.

This case uses grooves, through-holes, and conductive layers to connect opposite-side circuits without complex FFC processes.

A composite thin copper foil employs a release layer and anti-stick agent to resolve carrier sticking, ensuring uniform consolidation.

A flexible lighting device uses a phosphorescent cover excited by light emitters to maintain illumination.

An edge insulation pattern supports a flexible printed circuit board, reducing dead space while preventing moisture ingress.