Flexible COF Circuit Board With Through-Substrate Heat Dissipation
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Solution Overview
Problem
Chip on film (COF) methods face challenges in heat dissipation, leading to potential chip malfunction and reliability issues due to generated heat during operation.
Innovation Solution
A flexible circuit board with a substrate featuring holes and a heat dissipation part, including a heat dissipation pattern layer, connection layer, and heat dissipation layer, effectively dissipates heat generated by the chip through these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a chip is mounted on a flexible circuit board using COF method, then high density mounting and fine pitch are achieved, but heat dissipation capability deteriorates leading to chip malfunction and reliability issues
Solution Approach 1:
The invention transitions from conventional planar heat dissipation to three-dimensional heat dissipation by forming holes through the substrate thickness direction. The heat dissipation part extends from the first surface through the holes to the second surface, creating a vertical heat transfer path that increases the heat dissipation area without occupying additional lateral space, thus maintaining high mounting density while improving reliability
Solution Approach 2:
The substrate is designed with multiple holes forming a porous structure in the chip mounting region. These holes serve as heat dissipation pathways, allowing heat to escape from the chip mounting area through the substrate thickness. The porous structure increases the surface area for heat transfer while maintaining the flexibility and thin profile of the circuit board
2Reliability
If heat dissipation structures are added to the flexible circuit board, then heat dissipation capability is improved, but device complexity increases
Solution Approach 1:
The invention merges the heat dissipation function with the existing substrate structure by forming holes directly in the substrate and creating the heat dissipation part as an integrated component. The connection layer is formed within the holes, combining structural support and thermal conduction functions in a single integrated design, thereby improving heat dissipation without proportionally increasing device complexity
Solution Approach 2:
The holes formed in the substrate serve multiple functions: they provide mechanical support as part of the substrate structure, act as thermal conduction pathways for heat dissipation, and enable the connection between the heat dissipation part and the chip mounting region. This multi-functionality reduces the need for separate components, maintaining simplicity while achieving effective heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible substrate and chip package demonstrate improved heat dissipation characteristics, enhancing the reliability and driving performance of the chip package by efficiently transferring heat to the outside.
Implementation Method 1
the heat dissipation part includes: a heat dissipation pattern layer disposed on the first surface; a connection layer disposed inside the hole; and a heat dissipation layer disposed on the second surface
Data Source
AI summary
A flexible circuit board for a chip on film according to an embodiment includes: a substrate including a first surface and a second surface opposite to the first surface and including a chip mounting region; a circuit pattern layer disposed on the first surface; and a heat dissipation part disposed in the chip mounting region, wherein the substrate is formed with at least two or more holes that are formed in a region overlapping the heat dissipation part, and the heat dissipation part includes: a heat dissipation pattern layer disposed on the first surface; a connection layer disposed inside the hole; and a heat dissipation layer disposed on the second surface.