FPCB Antenna Module Layout for Radiating Sheet Heat Dissipation
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Solution Overview
Problem
Existing electronic devices face heat dissipation challenges, particularly with multiple heat-generating components attached to a single radiating sheet, which can lead to damage and accumulation of heat, reducing the lifespan and performance of the device.
Innovation Solution
An electronic device design featuring a nonconductive layer extending from the radiating sheet to regions with electronic components, enhancing the sheet's strength and preventing damage from relative movement, while also improving heat radiation performance by spreading heat across multiple regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple electronic components are attached to one radiating sheet, then heat dissipation coverage is improved, but the radiating sheet may be damaged by relative movement between components
Solution Approach 1:
The patent divides the radiating sheet into multiple independent radiating regions, each capable of dissipating heat from attached electronic components. This segmentation allows the sheet to maintain structural integrity while providing extensive heat dissipation coverage across multiple zones.
Solution Approach 2:
The patent employs a composite structure combining the radiating sheet with an FPCB antenna module that has extended beyond its original boundaries. This composite design reinforces the radiating sheet, preventing damage from relative movement between components while maintaining effective heat dissipation across the extended area.
2Productivity
If the radiating sheet is extended to cover more regions, then heat dissipation performance is improved, but the sheet becomes more susceptible to damage
Solution Approach 1:
The patent creates a composite structure where the FPCB antenna module extends beyond its original boundaries to reinforce the radiating sheet. This composite design maintains the sheet's strength while enabling extended heat dissipation coverage across multiple regions.
Solution Approach 2:
The FPCB antenna module serves dual functions: it provides wireless communication functionality and simultaneously acts as a structural reinforcement for the radiating sheet. This multi-functionality allows the sheet to be extended for better heat dissipation without compromising strength.
3Volume of moving object
If electronic components are highly integrated to reduce device size, then compactness is improved, but heat generation increases
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent radiating regions within the compact device. Each region can independently dissipate heat from nearby integrated components, effectively managing thermal loads despite the small overall device volume.
Solution Approach 2:
The patent utilizes the surface area of the radiating sheet in the two-dimensional plane to maximize heat dissipation within the constrained three-dimensional device volume. By spreading heat dissipation across multiple regions on the sheet surface, the patent effectively manages thermal loads without increasing device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated by electronic components, preventing damage to the radiating sheet and maintaining device performance by ensuring efficient heat radiation across multiple regions, thus extending the device's lifespan.
Implementation Method 1
a radiating sheet may be attached to the electronic components. When a plurality of electronic components generating heat is attached to one radiating sheet
Implementation Method 2
a nonconductive layer extending on a radiating sheet to a region in which an electronic component is positioned, thereby enhancing the strength of the radiating sheet
Data Source
Figure 1
Figure 2~3A
Figure 3B
AI summary
An electronic device includes a housing configured to form an internal space, a radiating sheet configured to be disposed in the internal space; at least one electronic component configured to be disposed in the internal space and to be in contact with the radiating sheet. An FPCB antenna module configured to be disposed on the radiating sheet includes a conductive pattern and a nonconductive layer configured to surround the conductive pattern, wherein the nonconductive layer may extend on the radiating sheet to a region in which the electronic component is positioned.