Dual-Surface COF Package Layout for Higher-Resolution Displays

The patent transitions from attaching COFs only on one surface of the display panel to attaching them on both surfaces. This dimensional expansion allows the same number of COFs to be distributed across two surfaces, maintaining adequate spacing between adjacent COFs while achieving higher overall resolution. The dual-surface arrangement effectively doubles the available mounting area without compressing the spacing between individual COFs.

The patent divides the COF array into two separate groups: first COFs attached to the first surface and second COFs attached to the second surface. This segmentation allows each surface to handle a manageable number of COFs with appropriate spacing, while the combined effect achieves higher resolution. The segmentation simplifies the attachment process and reduces the complexity associated with managing a large number of COFs on a single surface.

The manufacturing process is segmented into separate steps for attaching COFs to the first surface and second surface. This segmentation allows each attachment operation to be optimized independently, using standard attachment techniques without the complications of managing all COFs simultaneously on one surface. The divided approach makes the overall manufacturing process more manageable despite the increased quantity of COFs.