Flexible Circuit Tape Layout for High-Density Outer Lead Assembly
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Solution Overview
Problem
Conventional flexible circuit boards face challenges in assembly and electrical connectivity due to the need for multiple boards to connect with miniaturized LEDs, leading to over-bending and separation issues, which affect yield and reliability.
Innovation Solution
A flexible circuit tape and board design with increased substrate width and optimized lead arrangements, allowing for more outer leads to conform to the number of contacts on external components, enhancing electrical connections and reducing assembly difficulties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple flexible circuit boards are used to connect to display panel with more LEDs, then the number of LEDs can be increased, but assembly process and electronic control become difficult
Solution Approach 1:
The patent merges multiple flexible circuit boards into a single integrated flexible circuit tape structure. The circuit tape includes multiple substrate units arranged in series, each with circuit lines connecting to the display panel, eliminating the need for separate flexible circuit boards and simplifying the assembly process while supporting increased LED counts
Solution Approach 2:
The flexible circuit tape is segmented into multiple substrate units arranged in a first direction, with each substrate unit containing circuit lines and outer leads. This segmentation allows the tape to be divided into manageable sections while maintaining overall functionality and simplifying assembly compared to bonding multiple complete flexible circuit boards
2Quantity of substance
If multiple flexible circuit boards are bonded to display panel, then more LEDs can be connected, but assembly becomes difficult and space is restricted
Solution Approach 1:
The patent combines multiple flexible circuit boards into a single flexible circuit tape that integrates multiple substrate units and circuit lines. This merged structure occupies less space than multiple separate flexible circuit boards while maintaining the capability to connect to numerous LEDs on the display panel
3Area of stationary object
If flexible circuit boards are over-bent to fit restricted space, then space constraint is met, but separate from display panel reducing yield or reliability
Solution Approach 1:
The patent modifies the geometric parameters of the flexible circuit tape, specifically setting the width of each substrate unit to be greater than or equal to 80mm and the width between outermost outer leads to account for 60.00-99.00% of the substrate unit width. These parameter changes provide sufficient space for reliable bonding while maintaining flexibility to fit restricted spaces without over-bending
4Quantity of substance
If width of substrate unit is increased to arrange more outer leads, then number of outer leads increases to match external component contacts, but manufacturing complexity increases
Solution Approach 1:
The flexible circuit tape is divided into multiple substrate units arranged in a first direction, with each substrate unit containing circuit lines and outer leads. This segmentation allows the wide substrate units to be manufactured using standardized processes while achieving the required number of outer leads through the series arrangement of multiple units
Solution Approach 2:
The patent specifies that the width of each substrate unit should be greater than or equal to 80mm and the width between outermost outer leads should account for 60.00-99.00% of the substrate unit width. These parameter specifications guide manufacturing to achieve sufficient space for outer leads while maintaining manufacturability through standardized dimensions
Data Source
AI summary
A flexible circuit tape includes flexible circuit boards each including a substrate unit and a circuit unit. The circuit unit is disposed on a routing region of the substrate unit and includes circuit lines each having an inner lead and an outer lead. A second width between the two outermost outer leads accounts for 60.00-99.00% of a first width of the substrate unit. The first width is greater than or equal to 80 mm such that number of outer leads can be increased.