FPCB Buffer Structure for Impact-Resistant Connector Reliability

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Solution Overview

Problem

Existing flexible printed circuit boards (FPCBs) in electronic devices are vulnerable to damage from impacts and shocks, which can lead to connector failure and reduced device reliability.

Innovation Solution

Incorporation of shock absorbers to elastically support the FPCB, distributing stress and reducing damage by absorbing external disturbances such as vibrations and shocks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If FPCB is made flexible to connect components, then adaptability is improved, but reliability deteriorates due to vulnerability to impact damage

Engineering Contradiction:
ImproveflexibilityVSAvoidimpact resistance
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies beforehand cushioning by pre-installing shock absorbers at critical locations on the FPCB before impact occurs. These shock absorbers include elastic bodies positioned at vulnerable areas such as connectors and bending sections, along with damping structures that are activated only when impact occurs. This allows the FPCB to maintain flexibility during normal operation while having protective measures already in place to absorb and dissipate impact energy, thus resolving the contradiction between flexibility and impact resistance.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If shock absorbers are added to protect FPCB, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improveimpact resistanceVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs flexible shells and thin films by using thin elastic bodies and flexible damping structures that can be integrated into the FPCB layout without significantly increasing thickness or rigidity. These protective elements are designed as thin, flexible components that conform to the FPCB's flexible nature, providing impact protection while maintaining the overall flexibility and simplicity of the device structure. This approach avoids the need for bulky rigid protective enclosures.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent applies parameter changes by utilizing materials and structures with variable mechanical properties. The damping structures and elastic bodies are designed to remain flexible under normal conditions but exhibit increased stiffness and energy absorption capacity when subjected to impact forces. This dynamic parameter change allows the protective structures to adapt their mechanical properties based on loading conditions, providing effective protection without permanently increasing device complexity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The shock absorbers effectively reduce the risk of connector failure and enhance the reliability of FPCBs by distributing stress, thereby protecting the circuit board from damage.

Implementation Method 1

a deformable portion (722) configured to be deformed at least partially elastically

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Implementation Method 2

shock absorbers that buffers an impact applied to a flexible printed circuit board (FPCB)

Methodology Applied
Scientific EffectVibration damping: Damping

Data Source

PatentEP4451654B1Electronic device comprising buffer structure
Publication Date: 2026.03.11 SAMSUNG ELECTRONICS CO LTD
  • EP4451654B1 patent drawingFigure 1
  • EP4451654B1 patent drawingFigure 2A
  • EP4451654B1 patent drawingFigure 2B

AI summary

An electronic device may comprise: a first printed circuit board; a second printed circuit board; a flexible printed circuit board connected to each of the first printed circuit board and the second printed circuit board and extending between the first printed circuit board and the second printed circuit board; and a shock absorber configured to buffer the flexible printed circuit board.