Adhesive Bond Curing With Ultrasonic Polymerization Feedback
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Solution Overview
Problem
Conventional adhesive bonding methods are inefficient in terms of time and energy usage, and lack effective monitoring and control mechanisms to ensure the quality of the adhesive connection.
Innovation Solution
A method involving light-curing adhesive materials, where the degree of polymerization is continuously detected using ultrasonic methods such as sound velocity, resonance, or level measurements to terminate the curing process at a predetermined strength, allowing for precise control and non-destructive quality control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional adhesive bonding methods are used with fixed curing time, then the bonding process is simple to control, but the production time is long and energy consumption is high
Solution Approach 1:
The patent implements real-time feedback control by continuously monitoring the polymerization level of the adhesive material during curing using ultrasonic measurement. The curing process dynamically adjusts exposure based on measured polymerization progress, stopping immediately when the target level is reached. This feedback mechanism eliminates fixed-time curing inefficiencies, reducing both production time and energy consumption while maintaining bond quality.
Solution Approach 2:
The patent transitions from static fixed-time curing to dynamic adaptive curing. The curing process continuously adapts to the actual polymerization state of the adhesive material, adjusting exposure duration based on real-time measurements. This dynamic approach optimizes each bonding operation individually, improving productivity and reducing energy waste from unnecessary extended curing.
2Reliability
If conventional adhesive bonding methods are used, then the process is simple, but there is no effective monitoring or control of bond quality
Solution Approach 1:
The patent incorporates ultrasonic detection that provides real-time feedback on polymerization level throughout the curing process. This enables continuous monitoring of bond development, allowing immediate detection of inadequate curing. The feedback control ensures reliable bond quality by preventing premature termination while eliminating the need for complex post-curing inspection systems.
Solution Approach 2:
The patent replaces destructive mechanical testing methods with non-contact ultrasonic wave measurement. Ultrasonic waves propagate through the adhesive material, and changes in wave characteristics indicate polymerization progress. This substitution provides continuous quality monitoring without damaging the bond, maintaining simplicity while dramatically improving reliability control.
3Manufacturing precision
If ultrasonic measurement is used to monitor polymerization level, then the curing process can be precisely controlled, but the device complexity increases
Solution Approach 1:
The patent employs ultrasonic wave propagation measurement to monitor polymerization, replacing complex optical or chemical sensing systems. Ultrasonic transducers generate and detect sound waves that naturally penetrate the adhesive material, with measurement based on simple time-of-flight or attenuation calculations. This approach achieves precise polymerization control while maintaining relatively simple device architecture.
Solution Approach 2:
The ultrasonic measurement system utilizes the adhesive material itself as the measurement medium, requiring no additional sensors or indicators embedded in the material. The adhesive's inherent acoustic properties provide the measurement signal, eliminating the need for complex external monitoring systems and achieving precise control with minimal added complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster production of adhesive connections with improved quality, reducing energy waste and allowing for real-time monitoring of the bonding process, enabling the identification and rejection of faulty bonds without additional testing.
Implementation Method 1
curing a light-curing adhesive material (103) using light (101)
Implementation Method 2
the degree of polymerization is determined using an ultrasonic method. This achieves, for example, the technical advantage that the state of the adhesive bond can be precisely determined
Implementation Method 3
the ultrasonic method comprises a sound velocity measurement, a sound resonance measurement, and/or a sound level measurement
Data Source
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AI summary
The present invention relates to a method for producing an adhesive bond, comprising the steps of curing (S101) a light-curing adhesive material by means of light; detecting (S102) the degree of polymerization of the adhesive material; and terminating (S103) the curing at a predetermined degree of polymerization. In a preferred embodiment, the degree of polymerization is detected by means of an ultrasonic method.