Semiconductor Adhesive Film Viscosity Control for Crack-Free Wire Embedding
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Solution Overview
Problem
Adhesive films used in semiconductor bonding exhibit local deformation in the thickness direction during thermal curing, leading to potential cracks in semiconductor chips.
Innovation Solution
A thermosetting adhesive film with a minimum melt viscosity of 2500 Pa·s to 10000 Pa·s and a maximum tan δ of 1.0 or less in the range of 90° C. to 180° C., designed to suppress local deformation during thermal curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the adhesive film has low melt viscosity to ensure wire embedding, then wire embedding capability is improved, but local deformation in thickness direction increases during thermal curing
Solution Approach 1:
The patent applies parameter changes by precisely controlling the melt viscosity of the adhesive film within a specific range (2500-10000 Pa·s at 90-180°C) and limiting tan δ to 1.0 or less. This optimized parameter range allows the adhesive to have sufficient fluidity for wire embedding while maintaining enough viscosity to suppress excessive deformation during thermal curing, thereby resolving the contradiction between ease of operation and manufacturing precision.
2Ease of operation
If the adhesive film has high fluidity for wire embedding, then wire embedding capability is improved, but crack formation in semiconductor chip increases
Solution Approach 1:
The patent resolves this contradiction by changing the viscosity parameters of the adhesive film, specifically setting the minimum melt viscosity to 2500 Pa·s or more in the temperature range of 90°C to 180°C. This parameter control ensures the adhesive has adequate fluidity for wire embedding while preventing excessive thinning that would lead to cracks, thus maintaining chip integrity.
3Ease of operation
If the adhesive film deforms locally in thickness direction during thermal curing, then wire embedding is improved, but adhesive film uniformity deteriorates
Solution Approach 1:
The patent applies parameter changes by controlling the melt viscosity within 2500-10000 Pa·s and tan δ to 1.0 or less during thermal curing. This optimized parameter range allows the adhesive to deform sufficiently for wire embedding while maintaining enough structural stability to prevent localized thinning and preserve overall film uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive film effectively embeds wires while minimizing local deformation, preventing cracks and ensuring reliable semiconductor chip bonding.
Implementation Method 1
thermally curing the adhesive film to bond the second semiconductor chip to the structure
Implementation Method 2
The minimum melt viscosity and the maximum value of tan δ are values determined by measurement on a dynamic viscoelasticity of the adhesive film within a temperature range including a range of 90° C. to 180° C.
Data Source
AI summary
A thermosetting adhesive film for semiconductors is provided, the adhesive film being used to bond a semiconductor chip to an adherend while embedding a wire connected to another semiconductor chip. The adhesive film has a minimum melt viscosity of 2500 Pa·s or more and 10000 Pa·s or less in a range of 90° C. to 180° C. The minimum melt viscosity is a value determined by measurement on a dynamic viscoelasticity of the adhesive film within a temperature range including a range of 90° C. to 180° C. under the conditions of a temperature increasing rate of 5° C./min and a frequency of 1 Hz.