Non-Macromolecular Adhesive Additives TRIZ Cases

A PLA-based solvent coating helps biodegradable pots resist nursery moisture for weeks, then break down quickly after planting.

A thin sputtered metal coating on compressed nonwoven fibers with conductive adhesive improves core-wire adhesion and resists cracking during bending.

One-side filler localization and transferred surface roughness create different adhesion on each tape face while keeping the tape thin and simple to make.

A glycidylamine epoxy and oxetane adhesive enables inkjet-printed thin bonding layers with heat resistance, flexibility, and reliable semiconductor adhesion.

A 3D crosslinked adhesive layer improves positive electrode edge insulation, resists laser cutting damage, and reduces short-circuit risk.

A porous substrate with a discontinuous adhesive layer preserves lithium-ion flow, reduces cracking and plating, and supports safer battery cycling.

An ethylene carbonate bonding layer enables separator adhesion below 50°C, preserves pores, and avoids side reactions in lithium-ion batteries.

High filler loading lowers thermal expansion, while silatrane-based adhesion promotion keeps hot-melt silicone bonded to nickel and gold.

A rolled thermoplastic-thermosetting adhesive film enables uniform wafer bonding, CVD heat resistance, and easy support separation.

A porous substrate with a discontinuous adhesive layer preserves lithium-ion flow while supporting electrodes and reducing cracking and plating.

A dual-viscosity silica gel protective film prevents membrane swelling during CCM coating and peels cleanly to support uniform, continuous fuel cell production.

Magnetic metal particles in a multilayer epoxy tape absorb EMI while a separate adhesive layer preserves high peel strength after curing.

A phenyl-polysiloxane temporary adhesive balances strong wafer support during polishing with easy release and residue removal after thinning.

A reducing agent in UV dicing tape adhesive suppresses peroxyl radicals, preserving adhesion control and chip pick-up success.

A layered aerogel and inorganic sheet limits heat spread between lithium battery cells while improving dust resistance and durability.

An aerogel-based insulation sheet with a flame-retardant outer member slows heat transfer between lithium battery cells and helps prevent fire spread.

An SP-matched acrylic or epoxy adhesive bonds punched electrical steel sheets despite punching oil, improving core strength while reducing noise and vibration.

A hot-melt curable silicone die attach film balances gap filling and chip bonding with easy dicing tape peel-off after irradiation.

Controlled inorganic filler sizing in the adhesive layer suppresses expansion, improving laminated stator core flatness, space factor, and magnetic stability.

Rotary support and pressing plates improve electrode adhesion during stacking, reducing cell movement and boosting battery assembly stability.

A thermochromic adhesive layer in battery pouch packaging reveals heat buildup visually, avoiding added sensors, weight, and cell complexity.

Low-moisture silver adhesive enables pressureless sintering at 200-250°C, improving denseness, shear strength, and defect control.

A SIS-acrylic-PEG binder helps adhesive tape retain bonding and insulation in battery electrolyte, limiting swelling and leakage risk.

A thermoplastic adhesive film holds during semiconductor molding, then peels cleanly after high-temperature reflow without residue.

A composite separator binder using PVDF, PVP, and PVP-co-PVAc improves heat resistance and particle binding to delay battery short-circuits.

A functionalized monocarboxylic acid keeps copper nanoparticles stable in storage while enabling low-temperature sintering and strong, heat-resistant bonds.

A water-dispersed copolymer binder balances cathode adhesion and electrochemical stability while removing toxic NMP from battery electrode processing.

Surface-modified inorganic nitride improves heat conduction and dispersibility in thermally conductive layers for miniaturized power semiconductors.

Silver-containing particles with surface treatment and glutaric acid raise die bonding film thermal conductivity for better semiconductor heat dissipation.

Controlled DSC curing behavior lets this film adhesive cure fast at lower temperature to prevent chip cracks during wire bonding.

A sulfide-based conductive composition enables low-temperature sintering die attach with strong heat resistance, moisture control, and flux-free bonding.

A resin-filler non-conductive film controls melt viscosity and curing to prevent voids and maintain adhesion in fine-pitch thermocompression bonding.

Core-shell hybrid particles use graphene or dichalcogenide cores with metal or polymer shells to cut silver cost while improving conductivity and stability.

A four-step slurry mixing sequence handles high-molecular-weight binders while reducing viscosity, gelation, and coating instability.

A dual-carboxyl flux in a laminated bonding film suppresses migration during storage and preserves solder wettability in narrow-pitch semiconductor assembly.

A nonwoven water-curable adhesive layer bonds the pouch while preventing high-temperature shorts and suppressing flammable gas generation.

A crosslinked acrylate adhesive film uses (meth)acryloylmorpholine to keep room-temperature adhesion high while minimizing residue after peeling.

An acrylic rubber adhesive film stays attachable at room temperature, then peels cleanly after high-heat processing without residue.

A 2-4 GPa adhesive film redistributes stress to reduce semiconductor package warpage, slip, and bonding reliability loss.

Thin metallic and ceramic layers reflect heat and block flame penetration while keeping the cold side at 700°F or less.

A battery module curable composition balances low-viscosity injection, controlled waiting time, and rapid post-injection curing to cut device load.

3D helical conductive fibers in frame sealant improve dispersion, adhesion, and cell thickness consistency for stable LCD panel packaging.

Low-melting metal particles in the tack layer enable simpler wafer bonding with strong electrical connection and improved heat resistance.

An elastomer-rich thermosetting adhesive keeps die-bonding films at 15 μm or less while maintaining strength, limiting chip cracks and warpage.

A fat-soluble indicator in the washer adhesive preserves cohesion, prevents contamination, and reveals electrolyte leakage by color change.

An adhesive layer with thermosensitive polymer and fine particles lets windows self-adjust cloudiness with temperature while keeping the structure simple.

A hydroxyl UV absorber and resin blend enables strong wafer support during processing, then efficient UV-based separation with heat resistance and low bleed-out.

Concavities around fillers suppress resin flow during pressure bonding, keeping conductive particles in place and reducing short circuits.

Cross-linking a modified olefin polymer with multi-anhydride and epoxy improves low-temperature lamination adhesion and heat resistance.

A graded dielectric film with embedded bubbles smooths air-to-cover permittivity changes, cutting radar reflection and noise behind sealed fascia.

UV-cured acrylate adhesive bonds electrode foils to insulated layers, preventing stack slippage and misalignment during battery cell assembly.

Controlled melt viscosity and tan δ let this semiconductor adhesive film embed wires while limiting curing deformation that can crack chips.

By tuning tan delta and melt viscosity during curing, the film embeds wires while limiting thickness deformation that can crack semiconductor chips.

Polyhydroxyalkanoate copolymer films provide rapid biodegradation to reduce plastic pollution while maintaining mechanical strength and printability.

Silicone resin foam with controlled surface resistivity resolves the trade-off between high-temperature heat resistance and reliable adhesive strength.

A resin composition with polyfunctional thiols and latent curing agents bonds camera module components.

Sterically hindered phenols suppress premature peroxodicarbonate decomposition, enabling stable storage and low-temperature curing.

A polyacrylate composition uses an organosilane crosslinker and accelerator to enable rapid thermal curing at reduced temperatures.

Segmented two-component adhesive composition balances viscosity and pot life while maintaining temperature resistance.