Dicing Tape Adhesive Composition for Oxygen-Inhibited UV Pick-Up
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Solution Overview
Problem
The conventional dicing process in semiconductor chip fabrication is plagued by a die-lift phenomenon and oxygen inhibition, leading to decreased chip pick-up success rates due to the formation of peroxyl radicals from trapped oxygen during UV irradiation.
Innovation Solution
An adhesive composition for dicing tape comprising a (meth)acrylate-based resin, a reducing agent, and a photoinitiator, which mitigates the oxygen inhibition phenomenon by reducing peroxyl radicals, thereby maintaining adhesive force and improving chip pick-up success rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If UV light irradiation is applied to expand the cut wafer, then the chips can be separated and picked up, but oxygen inhibition phenomenon occurs at the periphery causing high adhesion and decreased pick-up success rate
Solution Approach 1:
The patent converts the harmful oxygen inhibition phenomenon into a beneficial effect by using the peroxyl radicals generated during UV irradiation to crosslink the adhesive. The reducing agent converts peroxyl radicals into reactive species that promote crosslinking, transforming the harmful oxygen reaction into a useful crosslinking mechanism that improves pick-up success rate while maintaining adhesive strength
Solution Approach 2:
The patent introduces a reducing agent as an intermediary substance that mediates between the peroxyl radicals (harmful) and the adhesive crosslinking (beneficial). The reducing agent converts peroxyl radicals into reactive species that can crosslink the adhesive, acting as a bridge that transforms the harmful oxygen inhibition into a useful crosslinking process
2Reliability
If adhesive force is increased to prevent chip damage during dicing, then chip security is improved, but adhesion remains too high causing fixation between film and chip
Solution Approach 1:
The patent creates a dynamic adhesive system where the adhesive properties change over time during UV irradiation. Initially, the adhesive maintains high strength to secure the chip during dicing. During UV irradiation, peroxyl radicals are generated and converted by the reducing agent into crosslinking species, progressively reducing adhesion strength to enable easy pick-up. This dynamic transition resolves the contradiction between initial high adhesion and final low adhesion requirements
Solution Approach 2:
The patent changes the chemical state and adhesive parameters during the UV irradiation process. The adhesive transitions from an initial state with high adhesion strength to a final state with reduced adhesion through photo-induced crosslinking. The reducing agent facilitates this parameter change by converting peroxyl radicals into crosslinking species, enabling the adhesive strength to decrease over time while maintaining chip security during dicing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition effectively reduces peroxyl radical formation, maintaining adhesive force and preventing decreases in chip pick-up success rates, while minimizing side reactions and time-dependent changes.
Implementation Method 1
the base film of the semiconductor wafer is irradiated with ultraviolet (UV) light
Implementation Method 2
a reducing agent; and a photoinitiator... the reducing agent mitigates the oxygen inhibition phenomenon by reducing peroxyl radicals
Data Source
AI summary
The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.