Adsorptive Temporary Fixing Sheet for Silicon Chips
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Solution Overview
Problem
Existing adsorption temporary fixing sheets, particularly silicone foam sheets, fail to provide sufficient shear adhesive strength in a direction parallel to their surface while maintaining weak adhesive strength vertically and adequate antistatic performance, which is crucial for applications in electronics and other industries.
Innovation Solution
An adsorption temporary fixing sheet with an open-cell foam layer structure, having specific silicon chip adhesive strength and shearing adhesive strength relationships, and surface resistivity within a defined range, ensuring strong lateral fixation and easy peeling, along with excellent antistatic properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If emulsion-based materials are used for foam sheets, then repeelability is excellent, but water resistance is poor and adsorptivity reduces when washed with water
Solution Approach 1:
The patent changes the material parameter from emulsion-based to silicone resin-based, fundamentally altering the chemical composition to achieve both water resistance and desired peeling properties. This parameter change resolves the contradiction by selecting a material class (silicone resin) that inherently possesses both water resistance and controllable adhesive characteristics.
Solution Approach 2:
The patent creates a composite structure by combining silicone resin with specific foam structures (open-cell or closed-cell) and incorporating functional additives. This composite approach allows the material to simultaneously achieve water resistance from the silicone resin base, controlled adsorptivity from the foam structure, and desired peeling characteristics from the composite formulation.
2Ease of operation
If pressure-sensitive adhesive tape is used for temporary fixing, then easy peeling is achieved, but adhesive residue occurs at high temperature and substrate breakage happens
Solution Approach 1:
The patent changes the adhesive material parameter from conventional pressure-sensitive adhesive to silicone resin-based adhesive, which maintains stable adhesive properties across wide temperature ranges. This parameter change eliminates the high-temperature adhesive residue problem while preserving easy peeling characteristics through controlled adhesive strength formulation.
Solution Approach 2:
The patent applies different local qualities within the adhesive layer by using silicone resin with specific molecular weight distributions and cross-linking densities. This allows the adhesive to exhibit weak vertical adhesion for easy peeling while maintaining strong shear adhesion for reliable fixing, and demonstrates heat resistance through the inherent thermal stability of silicone resin bonds.
3Temperature
If related-art silicone foam is used, then heat resistance is excellent, but shear adhesive strength is insufficient and antistatic performance is poor
Solution Approach 1:
The patent creates a composite silicone foam material by combining silicone resin base (providing heat resistance) with functional additives and optimized foam structure. This composite formulation simultaneously achieves high shear adhesive strength through enhanced molecular interactions and good antistatic performance through incorporated conductive components, while maintaining the inherent heat resistance of silicone resin.
Solution Approach 2:
The patent applies different local qualities within the silicone foam structure by optimizing cell structure, density distribution, and surface properties. This allows specific regions to provide shear adhesive strength through enhanced surface area and contact, while maintaining overall heat resistance through the silicone resin matrix, and achieving antistatic performance through localized conductive pathways.
4Temperature
If related-art silicone foam is used, then heat resistance is excellent, but antistatic performance is insufficient
Solution Approach 1:
The patent creates a composite silicone foam by incorporating conductive additives (such as carbon black, metal particles, or conductive polymers) into the silicone resin matrix. This composite structure maintains the heat resistance of silicone resin while introducing antistatic properties through the conductive network formed by the additives.
Solution Approach 2:
The patent applies antistatic quality locally within the silicone foam structure by creating conductive pathways through specific additive distribution patterns. This allows the material to maintain heat resistance in the bulk silicone resin while providing antistatic performance at the surface or through localized conductive networks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sheet achieves sufficient shear adhesive strength in a direction parallel to its surface, weak adhesive strength vertically, and excellent antistatic performance across a wide temperature range, preventing bubble inclusion and ensuring easy peeling without adhesive residue.
Implementation Method 1
a foam layer having an open-cell structure
Implementation Method 2
the adsorption temporary fixing sheet has a surface resistivity of from 1.0×10^4Ω/□ to 1.0×10^10Ω/□
Data Source
AI summary
Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, having a weak adhesive strength in a direction vertical to the surface, and having excellent antistatic performance. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, and has a surface resistivity of from 1.0×104 to 1.0×1010Ω/□, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 18 hours at each of such different temperatures as −30° C., 23° C., or 80° C. is represented by V1, V2, or V3 (N/1 cm2), and when a silicon chip shearing adhesive strength of the surface of the foam layer after 18 hours at each of such different temperatures as −30° C., 23° C., or 80° C. is represented by H1, H2, or H3 (N/1 cm□), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.