Thermally Conductive Sheet Composition for Miniaturized Power Devices
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Solution Overview
Problem
Existing thermally conductive materials struggle to effectively manage heat dissipation from miniaturized power semiconductor devices, necessitating improved thermal conductivity.
Innovation Solution
A composition comprising inorganic nitride and a specific compound represented by General Formula (1), which enhances thermal conductivity through surface modification and interaction, forming a thermally conductive sheet and layer for power semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermally conductive materials are used, then basic heat dissipation is provided, but thermal conductivity is insufficient for miniaturized power semiconductor devices
Solution Approach 1:
The patent uses composite materials by combining inorganic nitride particles (such as boron nitride) with organic resin components to create a thermally conductive composition. The inorganic nitride provides thermal conductivity pathways while the organic resin forms the matrix, creating a composite structure that achieves superior thermal conductivity compared to conventional single-material approaches.
Solution Approach 2:
The patent optimizes parameters including the particle size distribution of inorganic nitride (combining fine particles of 0.1-10 μm with coarse particles of 10-100 μm), the surface modification of particles, and the ratio of organic to inorganic components. These parameter changes enable the composition to achieve thermal conductivity of 1.0 W/m·K or more while maintaining processability.
2Temperature
If inorganic nitride particles are added to improve thermal conductivity, then heat dissipation performance increases, but dispersibility and smoothness of the material decrease
Solution Approach 1:
The patent controls the particle size parameters of inorganic nitride, using a bimodal distribution with fine particles (0.1-10 μm) for thermal conductivity and coarse particles (10-100 μm) for spacing. This parameter control prevents agglomeration and improves dispersibility while maintaining thermal performance.
Solution Approach 2:
The organic resin acts as an intermediary between inorganic nitride particles, providing a matrix that facilitates uniform dispersion. The resin components (including curing agents and modifiers) create compatible interfaces that prevent particle aggregation and ensure smooth distribution throughout the thermally conductive sheet.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves superior thermal conductivity, improving heat dissipation in miniaturized power semiconductor devices by forming a smooth and dispersible thermally conductive layer.
Implementation Method 1
a surface-modified inorganic substance in which an inorganic nitride or an inorganic oxide is surface-modified with a boronic acid compound
Implementation Method 2
a compound represented by General Formula (1)... E1 to E3 in General Formula (1) each represent —NH—
Implementation Method 3
a thermally conductive material, which promotes heat dissipation from the power semiconductor device
Data Source
AI summary
A composition contains an inorganic nitride, and a compound represented by General Formula (1).