Hot-Melt Silicone Die Attach Film for Easy Dicing Tape Release
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Solution Overview
Problem
Existing curable silicone compositions for semiconductor devices face challenges in achieving sufficient gap filling and bonding between semiconductor chips and substrates while also allowing easy removal of dicing tapes after high energy beam irradiation, leading to issues like cutting failures and reduced yield.
Innovation Solution
A hot-melt curable silicone composition comprising specific organopolysiloxane resins, liquid chain organopolysiloxanes, and aerosol silica, with a balanced mass ratio and additives, that provides adhesiveness under pressure, allowing easy peeling of dicing tapes post-irradiation, and excellent gap filling and bonding properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a UV-curable dicing tape is used to temporarily fix the wafer during dicing, then the wafer can be securely held for cutting, but after high energy beam irradiation the adhesive strength is reduced and the dicing tape cannot be easily peeled off
Solution Approach 1:
The patent changes the physical and chemical parameters of the die attach material by formulating a hot-melt curable silicone composition with specific components (organopolysiloxane resin, liquid chain organopolysiloxane, aerosol silica) and ratios. This composition exhibits temperature-dependent viscosity changes and curing characteristics that enable easy peelability after irradiation while maintaining strong initial adhesion.
Solution Approach 2:
The patent creates a composite material system combining the hot-melt curable silicone composition with the dicing tape. The composition contains multiple components (Component A1, A2, B, C, D) that work synergistically to provide both strong adhesion during dicing and easy removal after irradiation, resolving the contradiction between strength and peelability.
2Ease of operation
If the adhesive strength between die attach material and dicing tape is weakened to enable easy peel-off, then the dicing tape can be removed after dicing, but the temporary fixing property during dicing is reduced causing cutting failures
Solution Approach 1:
The patent introduces dynamic characteristics to the die attach material through its hot-melt properties. The material's viscosity and adhesion strength dynamically change with temperature and curing state, providing strong fixation during dicing (room temperature) and easy release after irradiation (heated state), thus resolving the contradiction between reliable fixing and easy peel-off.
Solution Approach 2:
The patent utilizes phase transition characteristics of the hot-melt curable silicone composition. The material transitions from a solid-like state at room temperature (providing strong adhesion) to a more fluid state when heated or irradiated (enabling easy peel-off). This phase transition behavior resolves the contradiction between maintaining strong temporary fixation and enabling easy removal.
3Strength
If a cured silicone adhesive sheet is used as die attach film, then the material provides good adhesion, but it cannot perform sufficient gap filling between individualized semiconductor chips and the substrate
Solution Approach 1:
The patent changes the rheological parameters of the die attach material by using a hot-melt curable silicone composition instead of a fully cured silicone. This composition maintains appropriate viscosity and flow characteristics at processing temperatures, enabling it to fill gaps between chips and substrate while providing strong adhesion, thus resolving the contradiction between adhesion strength and gap-filling capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables efficient temporary fixing and easy removal of dicing tapes, ensuring strong adhesion of semiconductor chips to substrates, improving production yield and durability of semiconductor devices by maintaining flexibility and reducing hardness even at high temperatures.
Implementation Method 1
a curable silicone composition having hot-melt properties... comprising: (A) an organopolysiloxane resin containing a component (A1) and a component (A2)... (B) a liquid chain organopolysiloxane... (C) a curing agent for the organopolysiloxane resin (A)
Implementation Method 2
the curable silicone composition has hot-melt properties, and when the curable silicone composition is pressure-bonded with heating to a substrate
Implementation Method 3
containing: (A) an organopolysiloxane resin... (B) a liquid chain organopolysiloxane... and (D) aerosol silica
Data Source
AI summary
[Problem] Provided is a hot-melt curable silicone composition, a laminate using the composition, and a method for producing a semiconductor device. The curable silicon composition is particularly useful as a material for a die attach film, and allows for easy peel-off of a dicing tape from the surface thereof once the dicing tape becomes unnecessary after the dicing in a process for producing a semiconductor device. The curable silicone composition has an excellent gap filling property and an excellent bonding property between a semiconductor chip and a substrate. [Solution] Provided is a curable silicone composition and use thereof the curable silicone composition comprising: (A) a specific organopolysiloxane resin or a mixture thereof; (B) a linear or branched curable reactive organopolysiloxane that is liquid at 25°C; (C) a predetermined curing agent; and (D) an aerosol silica, the curable silicone composition characterized in that the composition as a whole has a hot-melt property, has a mass ratio of the component (A) to the component (B) in a range of 2.50 to 3.00, and has a content of the component (D) contained in a total amount of the components (A) to (D) in a range of 2.0 to 10 mass%.