Inkjet-Printable Adhesive Composition for Thin Semiconductor Bonding

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing die bonding members face challenges in providing adhesiveness, heat resistance, and flexibility due to thermal stress from differing linear expansion coefficients between semiconductors and mounting boards, leading to adhesion and connection failures.

Innovation Solution

A curable composition for forming an adhesive structure using a glycidylamine-type epoxy compound, an oxetane compound, and a cationic polymerization initiator, with a glycidylamine-type epoxy compound proportion of 10% by mass or more, suitable for inkjet printing, to create an adhesive structure with improved heat resistance and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If die bonding member thickness is increased, then adhesion strength is improved, but device thickness increases

Engineering Contradiction:

Improveadhesion strengthVSAvoiddevice thickness

Core Design Contradiction:

StrengthVSLength of moving object

Solution Approach 1:

The patent changes the material properties by formulating a curable resin composition with specific resin combinations and ratios that achieve high adhesion strength at reduced thickness. The controlled viscosity and curing characteristics allow forming thin film structures (1-10 μm) that maintain sufficient bonding strength while minimizing device thickness.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a thin film formulation approach, creating a die bonding member that can be applied as a thin curable resin layer. The composition is designed to cure into a thin film structure that provides adequate adhesion strength without requiring increased thickness, thus resolving the contradiction between adhesion strength and device thickness.

Inventive Principle:

Principle #30Flexible shells and thin films

2Manufacturing precision

If curable resin composition is applied by inkjet printing, then thin film formation is achieved, but manufacturing complexity increases

Engineering Contradiction:

Improvefilm thickness uniformityVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent optimizes the rheological parameters of the curable resin composition, specifically controlling viscosity and curing characteristics, to enable reliable inkjet printing deposition. The composition is formulated to achieve uniform thin film formation through standard inkjet printing processes without requiring additional manufacturing steps or complex process controls.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adhesive structure exhibits excellent adhesiveness, heat resistance, and flexibility, reducing thermal stress and enhancing the reliability of semiconductor connections.

Implementation Method 1

contains a glycidylamine-type epoxy compound, an oxetane compound, and a cationic polymerization initiator

Methodology Applied

Scientific EffectCationic polymerization: Photopolymerisation

Data Source

PatentUS20250372563A1Curable composition for forming adhesive structure, adhesive structure, method of manufacturing adhesive structure, and semiconductor device

Publication Date: 2025.12.04 RICOH CO LTD

AI summary

Provided is a curable composition for forming an adhesive structure that can be discharged by an inkjet printing method and includes a glycidylamine-type epoxy compound, an oxetane compound, and a cationic polymerization initiator. In the curable composition for forming an adhesive structure, a proportion of the glycidylamine-type epoxy compound is 10% by mass or more.