Adhesive Composition for Hydrophobic Substrates
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Solution Overview
Problem
Conventional adhesives face difficulties in bonding materials or printing patterns on hydrophobic or water-repellent substrates, such as hydrophobic fabrics or plastics, due to their surface properties, which require complex surface modification processes for 3D pattern formation.
Innovation Solution
An adhesive composition comprising an epoxy resin, a modified urethane resin with ethylenically unsaturated groups, and an inorganic filler in nanoparticle form, specifically designed to bond materials or print patterns on hydrophobic or water-repellent substrates, is developed. The composition includes a modified epoxy resin formed by reacting an epoxy resin with an isocyanate or amine compound and a modified urethane resin with ethylenically unsaturated groups, along with a dilution solvent and inorganic filler, to enhance adhesion and coating properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional adhesive is used on hydrophobic or water-repellent substrates, then adhesion is poor, but surface modification is required which increases process complexity
Solution Approach 1:
The adhesive composition changes its chemical parameters by incorporating silane-modified epoxy resin and polyol-modified polyisocyanate that can chemically interact with hydrophobic surfaces. The silane groups and isocyanate groups in the adhesive formulation are designed to bond with low-energy surfaces, altering the adhesive's chemical properties to match the substrate's hydrophobic characteristics without requiring surface modification
Solution Approach 2:
The invention uses a composite adhesive system combining multiple resin components (epoxy resin, polyisocyanate, silane modifiers, polyol modifiers) that work synergistically. This composite formulation integrates both hydrophobic-bonding capability and strong adhesion properties in a single composition, eliminating the need for separate surface modification steps while achieving reliable bonding on water-repellent substrates
2Reliability
If surface modification is performed for 3D pattern formation, then bonding capability is improved, but manufacturing complexity increases
Solution Approach 1:
The invention extracts and removes the surface modification step from the manufacturing process. By designing an adhesive that inherently bonds to hydrophobic surfaces through its chemical composition (silane and isocyanate groups), the complex surface treatment processes are eliminated entirely, simplifying manufacturing while maintaining reliable bonding capability
Solution Approach 2:
The silane-modified epoxy resin and polyol-modified polyisocyanate act as chemical intermediaries that facilitate bonding between the adhesive and hydrophobic substrates. These modified resins serve as mediators that bridge the compatibility gap between polar adhesives and non-polar substrates, enabling direct bonding without surface modification
3Manufacturing precision
If conventional adhesive formulation is used, then coating properties are insufficient, but drying time increases
Solution Approach 1:
The adhesive formulation changes its physical parameters by incorporating specific ratios of epoxy resin, polyisocyanate, and modifiers that optimize both coating flow properties and evaporation rate. The balanced composition provides appropriate viscosity for precise coating while containing components that dry relatively quickly, reducing the drying time penalty
Solution Approach 2:
The adhesive composition exhibits local quality differentiation where different components serve specific functions: epoxy resin provides structural integrity and adhesion, polyisocyanate enhances bonding to hydrophobic surfaces, and modifiers adjust coating properties. This localized functionality within the formulation achieves good coating precision without excessive drying time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition effectively bonds materials or prints patterns on hydrophobic or water-repellent substrates with improved coating properties and short drying times, eliminating the need for surface modification and maintaining the inherent characteristics of the substrates, thus enhancing workability and functionality.
Implementation Method 1
producing a modified epoxy resin by reacting an epoxy resin having at least one or more hydroxyl group with an isocyanate compound or an amine compound having at least one or more hydroxyl group
Implementation Method 2
producing a modified urethane resin by reacting an urethane resin having an isocyanate group at its end with a compound having an ethylenically-unsaturated group
Implementation Method 3
An adhesive composition for hydrophobic or water-repellent substrate... which are employed to be adhered the same or different materials or print pattern on a hydrophobic or water-repellent substrate
Data Source
AI summary
Disclosed is an adhesive composition for hydrophobic or water-repellent substrate comprises an epoxy resin, a modified urethane resin, an inorganic filler in nanoparticle form, and a dilution solvent. The adhesive composition according to the present invention can be employed to be adhered the same or different materials or print pattern on a hydrophobic or water-repellent substrate.