Non-Macromolecular Adhesive Additives TRIZ Cases

A thin pressure-sensitive adhesive sheet uses black colorants to block light in both in-plane and thickness directions.

A curable adhesive composition containing a modified polypropylene-based resin with acidic groups and (meth)acryloyl moieties enables rapid peel strength development during battery assembly.

A rapid-curing epoxy repair composition uses specific amine curing agents to achieve sandable hardness in 120 to 200 minutes.

Silyl-terminated polyether adhesive reduces tack at elevated temperatures to enable clean substrate separation without mechanical deformation or damage.

A roughened metal foil with an adhesive layer simplifies solar cell electrical connections through hot pressing.

A floor adhesive combines a hydrolyzable silyl group-containing polyoxypropylene-based polymer, calcium carbonate, and hollow filler to form an elastic layer.

A resin composition uses a dihydroxybenzophenone-based ultraviolet absorber and specific photoinitiator to achieve high peel force on substrates.

Silane-modified nanoparticles enhance resin adherence to wood strands.

Succinic acid ester mixtures plasticize polyvinyl chloride with low dissolution temperatures, replacing phthalates to improve environmental safety.

Silica-reinforced acrylic adhesive resolves strength-reliability contradictions by absorbing stress and enhancing heat resistance.

Dual UV and thermal curing prevents yellow mura and light leakage under ink steps in display assemblies.

A curable adhesive composition combines bisphenol F and A epoxy resins with rubber-modified components to enhance toughness.

A thermosetting epoxy resin composition incorporates porous polyurea particles supporting an aluminum chelate to enhance low-temperature curability.

An acrylic resin composition maintains tensile strength after oleic acid immersion through specific monomer unit proportions.

Ring hydrogenation of dialkyl terephthalates using a heterogeneous catalyst to produce plasticizer components.

A liquid silicone adhesive composition uses dual curing to enable stable room temperature storage and transport.

A hot melt adhesive composition creates semi-crystalline bonds using propylene-based copolymers.

Functionalized aconitic acid derivatives bond with phosphorus compounds to create sustainable flame-retardant polymers.

Vacuum pressure displaces air from fiberglass yarns during resin impregnation, ensuring complete saturation and preventing bond failure caused by trapped voids.

Isosorbide monomers accelerate curing speed and torque strength on oily steel substrates.

Composite microstructured coatings reduce ice adhesion while maintaining durability against cyclic icing.

Salt incorporation in aqueous polymer dispersions maintains pot life while enabling strong film lamination adhesion without hydroxy-functional monomers.

Heat-activatable foamable honeycomb core splice adhesive utilizes a curable polymer matrix with specialized blowing agents to expand and form protective structures.

Combining polysilsesquioxane with organometallic compounds maintains transparency while improving heat resistance in optical adhesives.

Formula (I) esters prevent migration and toxicity while preserving extrudability and mechanical stability.

A 1,3-substituted imidazolium salt with a dicyanamide anion acts as a latent catalyst for epoxy compounds.

A chlorosulfonated polyethylene latex formulation uses a polyoxyalkylene alkyl ether sulfate and fatty acid salt emulsifying system.

A surface protective film uses a cured urethane-acrylic adhesive layer to provide temporary bonding without plasticizers.

A curable composition combines a guanidine compound with a methyl ester group-containing additive to accelerate siloxane bond formation.

Acrylic polymer emulsion with epoxy curing agents forms a formaldehyde-free adhesive composition.

Hydrogenated block copolymer composition resolves holding power and tack trade-offs through molecular weight control.

Polar functional group-modified conjugated diene polymer improves hot melt adhesive compatibility.

Salt catalysts enable rapid silane curing independent of humidity, eliminating storage delays.

A curable resin composition combines epoxy resins with glycidyl group-containing acrylic polymers to form a crosslinked network.

Silicone pressure-sensitive adhesive composition incorporates adhesion promoting compounds to enhance substrate bonding.

Composite adhesive resolves the trade-off between heat dissipation performance and adhesive strength by utilizing solder particles for thermal conduction.

A polythiol composition forms from 5-vinylnorbornene and hydrogen sulfide under ultraviolet light to yield sulfur-containing structures.

A semiconductor package manufacturing method uses press-bonding with adhesive followed by sealing and heating to form metallic bonds.

Nanosilica-modified thermoplastic polyurethane film prevents excessive penetration into fabrics, resolving adhesive failure while reducing product weight.

Siloxane adhesive layers convert to ceramic-like structures through thermal processing at 100-500°C.

A double-sided adhesive uses asymmetric glass transition temperatures to enable clean separation of adhered substrates.

Separating wax emulsion into a bonding agent reduces nozzle clogging and agglomerate formation while maintaining print film durability.

A two-component urethane adhesive uses microparticles to control viscosity while maintaining curing speed.

Silane-modified epoxy and polyisocyanate adhesives bond water-repellent materials, eliminating complex surface modification steps.

Aromatic compounds with high melting points improve flame retardancy while maintaining low dielectric constants and flow properties.

Silane coupling agent and peroxide crosslinking system bond fluorine-based elastomer to metallic support.

An adhesive film combines hydroxyl group-containing methacrylate copolymers with core-shell nanoparticles to achieve low haze and strong adhesion.

An adhesive film balances melt viscosity with weight loss ratio to embed semiconductor elements securely.