Resin Composition for Display Adhesive with UV Shielding
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Solution Overview
Problem
Existing adhesive members in display devices face challenges in maintaining stable component integration and preventing display quality deterioration, particularly in terms of adhesion strength and UV light resistance.
Innovation Solution
A resin composition incorporating a dihydroxybenzophenone-based ultraviolet absorber, a photoinitiator that absorbs light in the 400 nm to 450 nm wavelength range, and a combination of monofunctional (meth)acrylate monomers and (meth)acrylate oligomers, which, upon photocuring, achieves a 180° peel force of 800 gf/25 mm or greater on glass and polymer substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional adhesive members are used in display devices, then component integration is maintained, but adhesion strength deteriorates and UV light resistance is insufficient
Solution Approach 1:
The patent uses a composite resin composition containing multiple functional components: (meth)acrylate oligomer as base resin, monofunctional (meth)acrylate monomer for flexibility, dihydroxybenzophenone-based ultraviolet absorber for UV protection, and photoinitiator for photocuring. This composite formulation achieves both strong adhesion (180° peel force ≥800 gf/25 mm) and UV resistance while maintaining service life
Solution Approach 2:
The patent optimizes specific parameters including the weight ratio of (meth)acrylate oligomer (5-20 wt%), monofunctional (meth)acrylate monomer (70-85 wt%), ultraviolet absorber (1-5 wt%), and photoinitiator (0.1-2 wt%). These parameter optimizations ensure the adhesive achieves both strong bonding strength and UV shielding properties
2Object-affected harmful factors
If ultraviolet absorber is added to resin composition, then UV light resistance is improved, but visible light transmittance may be reduced
Solution Approach 1:
The patent selects specific parameters for the ultraviolet absorber (dihydroxybenzophenone-based, 1-5 wt%) and photoinitiator (0.1-2 wt%) to achieve optimal balance. This parameter optimization allows the adhesive to absorb UV light effectively while maintaining high visible light transmittance (≥85% at 450 nm), solving the contradiction between UV protection and visible light transmission
3Productivity
If photoinitiator absorbing 400-450 nm light is used, then curing efficiency is improved, but UV absorber compatibility may be reduced
Solution Approach 1:
The patent creates a compatible composite system where the photoinitiator (absorbing 400-450 nm light) works synergistically with the dihydroxybenzophenone-based ultraviolet absorber. The specific weight ratios (photoinitiator 0.1-2 wt%, UV absorber 1-5 wt%) ensure that the photoinitiator can effectively initiate curing while the UV absorber provides stable adhesion and UV protection, resolving the compatibility issue
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive member formed from this resin composition exhibits excellent adhesion strength, UV shielding properties, and visible light transmittance, thereby ensuring reliable display performance and extended lifespan.
Implementation Method 1
a photoinitiator that absorbs light in a wavelength region of about 400 nm to about 450 nm
Implementation Method 2
a dihydroxybenzophenone-based ultraviolet absorber
Implementation Method 3
the resin composition after photocuring
Data Source
AI summary
Provided is a resin composition that may include a dihydroxybenzophenone-based ultraviolet absorber, a photoinitiator that absorbs light in a wavelength region of about 400 nm to about 450 nm, at least one monofunctional (meth)acrylate monomer and at least one (meth)acrylate oligomer. The resin composition after photocuring has a 180° peel force of about 800 gf/25 mm or greater for at least one among a glass substrate and a polymer substrate at about 25° C. Therefore, the resin composition may show excellent applicability before being cured and may show excellent adhesion after being cured.