Fluoroelastomer Adhesive Composition for Semiconductor Sealing
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Solution Overview
Problem
Existing adhesive compositions for fluorine-based elastomers, such as perfluoroelastomers, face challenges with low adhesive strength, high reactivity, and cost, particularly in semiconductor device manufacturing, where they require baking treatment and may contain metallic compounds that cause particle issues.
Innovation Solution
A novel adhesive composition incorporating a silane coupling agent with specific functional groups reacting with both inorganic and organic materials, combined with a crosslinking agent from the oxazole, thiazole, or imidazole system, which crosslinks with the fluorine-based elastomer, eliminating the need for organometallic compounds and baking, and enhancing adhesion strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a silane coupling agent is used to enhance adhesion between perfluoroelastomer and metallic support, then adhesive property is improved, but adhesive strength is insufficient
Solution Approach 1:
The patent combines a silane coupling agent (for inorganic-organic interface bonding) with a peroxide crosslinking agent (for elastomer crosslinking) to create a composite adhesive system. This dual-component approach allows the silane to provide initial adhesion while the peroxide crosslinking reinforces the bond through crosslinking the perfluoroelastomer chains, achieving both good adhesive property and high adhesive strength
Solution Approach 2:
The patent optimizes the concentration ratio of silane coupling agent to peroxide crosslinking agent, and controls the crosslinking conditions (temperature, time) to achieve maximum adhesive strength. By adjusting these parameters, the system transitions from simple adhesion to reinforced crosslinked adhesion
2Strength
If a vulcanizing adhesive composition with organometallic compound is used to achieve high adhesive strength, then adhesive property is improved, but handling becomes difficult due to high reactivity
Solution Approach 1:
The patent replaces expensive and highly reactive organometallic compounds with a more stable combination of silane coupling agent and peroxide crosslinking agent. This substitution maintains adhesive effectiveness while dramatically improving handling safety and ease of use, as peroxides are much more stable than organometallic compounds
Solution Approach 2:
The silane coupling agent acts as an intermediary between the metallic support and the peroxide crosslinking system. It first bonds to the metal surface, then provides reactive groups for peroxide crosslinking, creating a staged reaction process that is easier to control than direct organometallic reactions
3Strength
If a vulcanizing adhesive composition with organometallic compound is used to achieve high adhesive strength, then adhesive property is improved, but cost increases
Solution Approach 1:
The patent substitutes expensive organometallic compounds with cheaper, readily available silane coupling agents and peroxide crosslinking agents. This replacement significantly reduces material cost while maintaining or improving adhesive performance through the combined adhesion-crosslinking mechanism
4Strength
If baking treatment is applied to fix the primer composition, then adhesion is achieved, but processing time and energy consumption increase
Solution Approach 1:
The peroxide crosslinking system is designed to crosslink the perfluoroelastomer spontaneously at service temperature without requiring external baking treatment. The crosslinking reaction proceeds automatically once the adhesive is applied, eliminating the need for energy-consuming baking processes and reducing processing time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high adhesion strength, ease of handling, and cost-effectiveness without the need for baking treatment, while avoiding metallic compounds that could cause particle issues in semiconductor devices.
Implementation Method 1
a coupling agent composed of a compound having a first functional group that reacts with an inorganic material and a second functional group that reacts with an organic material
Implementation Method 2
a crosslinking agent capable of crosslinking with a crosslinking site of a fluorine-based elastomer
Data Source
AI summary
An adhesive composition includes a coupling agent composed of a compound having a first functional group that reacts with an inorganic material and a second functional group that reacts with an organic material, and a crosslinking agent capable of crosslinking with a crosslinking site of a fluorine-based elastomer. A seal structure body includes a metallic support, fluorine-based elastomer and adhesive composition that causes fluorine-based elastomer to adhere to metallic support. A method for manufacturing seal structure body includes the steps of providing metallic support and fluorine-based elastomer, and causing fluorine-based elastomer to adhere to metallic support by using adhesive composition. Accordingly, an adhesive composition with high adhesion strength as well as a seal structure body and a method for manufacturing the same are provided at low cost.