Adhesive Layer Moisture Barrier for Display Panel Bezel Reduction

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Solution Overview

Problem

Conventional display devices face issues with moisture penetration at the bonding interface between the panel pad and circuit board, leading to reliability concerns and a larger bezel size due to less integrated connections.

Innovation Solution

A display device design featuring a first circuit board with a conductive layer, passivation layer, and adhesive layer that is attached to the display panel, preventing moisture ingress and reducing bezel size by direct attachment to the panel's side surface via an adhesive layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional bonding method is used between the panel pad and circuit board, then the device structure is simple, but moisture can penetrate into the bonding portion causing reliability issues

Engineering Contradiction:
Improvebonding portion reliabilityVSAvoidmoisture penetration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

An adhesive layer is introduced as an intermediary substance between the circuit board and display panel. This adhesive layer serves as a moisture barrier that prevents moisture from penetrating into the bonding portion, thereby improving reliability without complicating the overall device structure

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The adhesive layer functions as a thin film barrier that seals the bonding interface. This thin film approach effectively blocks moisture penetration while maintaining a compact and simple device structure

Inventive Principle:
Principle #30Flexible shells and thin films

2Area of stationary object

If the circuit board is attached only to the top surface of the panel, then the manufacturing process is simple, but the bezel size becomes large

Engineering Contradiction:
Improvebezel sizeVSAvoidattachment process complexity
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The attachment method transitions from a single-plane (top surface only) bonding to a multi-dimensional approach by extending the adhesive layer onto the side surface of the display panel. This dimensional extension allows the circuit board to be more integrated with the panel, reducing bezel size while keeping the manufacturing process manageable

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Area of stationary object

If the circuit board is directly attached to the side surface of the panel, then the bezel size is reduced, but cracks may occur in the circuit board

Engineering Contradiction:
Improvebezel sizeVSAvoidcircuit board integrity
Core Design Contradiction:
Area of stationary objectVSStrength

Solution Approach 1:

The adhesive layer serves as a cushioning intermediary between the rigid circuit board and the display panel. This adhesive layer absorbs and distributes mechanical stresses, preventing stress concentration that would otherwise cause cracks in the circuit board during bending or attachment

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The adhesive layer is applied in advance to create a protective cushioning layer before the circuit board is attached to the side surface. This pre-applied adhesive layer prevents cracks by distributing mechanical stresses before they can concentrate and cause damage to the circuit board

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the reliability of the display device by preventing moisture penetration and minimizing bezel size, while also reducing the risk of circuit board cracks.

Implementation Method 1

an adhesive layer disposed on the passivation layer to at least partially cover a top surface and side surface of one end portion of the display panel

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS12144215B2Display device and method for manufacturing the same
Publication Date: 2024.11.12 SAMSUNG DISPLAY CO LTD
  • US12144215B2 patent drawing
  • US12144215B2 patent drawing
  • US12144215B2 patent drawing

AI summary

A display device and a method for manufacturing a display device are provided. An embodiment of a display device includes a display panel including a pad area including a plurality of pads, a first circuit board disposed to partially overlap the pad area; wherein the first circuit board includes: a first base board; a conductive layer disposed on the first base board and including a plurality of first bumps disposed on one end portion of the first base board, a plurality of second bumps disposed on the opposite end portion of the first base board, and a lead wiring connecting the first bump to the second bump, a passivation layer disposed on the first base board to cover the lead wiring; an adhesive layer disposed on the passivation layer to at least partially cover a top and side surface of one end portion of the display panel.