Printed Circuit Manufacture TRIZ Cases
- PCB Thermal Engraving Groove for Soldering Distortion Control
A printed circuit board uses a thermal engraving groove around through holes to manage copper coverage and heat dissipation.
- Chip Resistor Electrode Solder Wettability and Plating Process
Plated copper electrodes resolve insufficient solder wettability of conventional alloys, ensuring reliable fillet formation.
- Horizontal PCB Connection Terminal for Low-Profile LED Lighting
A horizontal connection terminal integrates into a printed circuit board to reduce overall system height.
- Copper-Silver Plating Film Methionine Complexing Agent
Methionine complexing agent stabilizes silver ions in copper electrolytic plating baths to form alloy films with high mechanical strength.
- Aromatic Polysulfone Resin Film Toughness via Organic Additive
Aromatic polysulfone resin film incorporates organic compounds with boiling points between 250°C and 400°C to resolve insufficient toughness in thin films.
- Rotary Table Adsorption Detection Without Rotary Joints
Relocating pressure detection to stationary housing eliminates rotary joints, resolving friction that degrades rotating accuracy.
- Tin Alloy Electroplating for Whisker-Free Deposits
Pulse reverse plating eliminates organic additives to prevent whisker growth while maintaining controlled grain size.
- Back-Drilling Multi-Layer PCBs Using Conductive Electrical Sensing
A conductive cutting device detects contact layers during back drilling to control stub length in multi-layer circuit boards.
- Curable Resin Composition with Segmented Silica for Narrow Wiring Embeddability
Segmented silica particles in a curable resin composition improve insulation reliability and resolution for narrow line space configurations.
- Modular Power Supply Communication Module Design
Separable communication module connects to a power supply sub-board via a socket assembly for easy user replacement.
- Chip Resistor Lower Electrode Heat Dissipation
Extended lower electrodes conduct heat from the resistor film to the printed board through the insulating substrate thickness.
- Phase Shift Pulse Plating for High Aspect Ratio Through-Hole Filling
Phase shift pulse plating deposits copper bridges in through-holes using offset waveforms on both substrate sides.
- Sn-Cu-Ni Solder Joint Composition for Crack Resistance
A lead-free Sn-Cu-Ni solder alloy stabilizes intermetallic compounds to prevent crack formation during solidification.
- Monitoring Module Cooling Device With Insulating Heat Conductor
An insulating heat conductor transfers thermal energy from radiating components to a metallic element, reducing electromagnetic field intensification.
- Auxetic Substrate With Elastic Sheets For Uniform Strain
A stretchable substrate uses an auxetic structure with attached elastic sheets to control strain distribution across the device.
- Conductive Ink Patterns for Display Device Bonding
Conductive ink patterns link circuit boards to pad electrodes, reducing dead space and preventing panel damage during bonding.
- Component Embedded Substrate Pad Arrangement Optimization
A design support apparatus selects electrode pad arrangements on component embedded substrates based on acquired mounting board information.
- Sn-Ag-Cu-Bi-Sb-Co Solder Alloy for Automotive Shock Resistance
Optimized multi-element solder alloy maintains structural integrity under severe temperature cycles, preventing joint cracking in automotive electronics.
- PCB Recessed Insulating Layer for Flexible Cable Connection
A printed circuit board assembly uses a recessed insulating layer to embed flexible cables directly into conductive lines.
- Angle Sensor Multilayer Coil Overlap Design
Vertical coil separation eliminates lateral gaps, reducing angle sensor size while preventing foreign substance intrusion.
- Component Mounting Machine Nozzle Control for Negative Pressure Leakage
A component mounting machine manages simultaneous nozzle pickup operations using independent negative pressure supply units.
- Automatic Splicing Device Empty Cavity Detection
A connection control device detects empty cavities in tape segments to automate splicing settings for component mounters.
- Copper Plating Process Using Bromide Pre-treatment for Uniform Thick Layers
A copper plating method uses bromide compound ions in a pre-treatment solution to deposit uniform and flat copper membranes.
- Laser Scribing Capacitive Touch Panels with Dynamic Focusing
Dynamic lens adjustment directs a laser beam to separate focal spots, resolving the contradiction between process complexity and pattern differentiation.
- Polyamide Polyamine Leveler for Circuit Board Plating
A polyamide polyamine compound acts as a leveler in electrolytic copper plating baths to control copper precipitation and enhance film uniformity.
- Circuit Board Dielectric Layer Active Particles Adhesion
Active particles in dielectric layers anchor conductive copper, preventing peeling during MSAP fabrication.
- Component Mounting System Cycle Time Simulation
A component mounting system executes production cycle time simulations to compare results before and after data changes.
- Thermoplastic Component Heat Trap Layer for Soldering
A thermoplastic component applies a duroplastic heat trap layer to prevent thermal damage to the substrate during soldering.