Printed Circuit Manufacture TRIZ Cases

A printed circuit board uses a thermal engraving groove around through holes to manage copper coverage and heat dissipation.

Plated copper electrodes resolve insufficient solder wettability of conventional alloys, ensuring reliable fillet formation.

A horizontal connection terminal integrates into a printed circuit board to reduce overall system height.

Methionine complexing agent stabilizes silver ions in copper electrolytic plating baths to form alloy films with high mechanical strength.

Aromatic polysulfone resin film incorporates organic compounds with boiling points between 250°C and 400°C to resolve insufficient toughness in thin films.

Relocating pressure detection to stationary housing eliminates rotary joints, resolving friction that degrades rotating accuracy.

Pulse reverse plating eliminates organic additives to prevent whisker growth while maintaining controlled grain size.

A conductive cutting device detects contact layers during back drilling to control stub length in multi-layer circuit boards.

Segmented silica particles in a curable resin composition improve insulation reliability and resolution for narrow line space configurations.

Separable communication module connects to a power supply sub-board via a socket assembly for easy user replacement.

Extended lower electrodes conduct heat from the resistor film to the printed board through the insulating substrate thickness.

Phase shift pulse plating deposits copper bridges in through-holes using offset waveforms on both substrate sides.

A lead-free Sn-Cu-Ni solder alloy stabilizes intermetallic compounds to prevent crack formation during solidification.

An insulating heat conductor transfers thermal energy from radiating components to a metallic element, reducing electromagnetic field intensification.

A stretchable substrate uses an auxetic structure with attached elastic sheets to control strain distribution across the device.

Conductive ink patterns link circuit boards to pad electrodes, reducing dead space and preventing panel damage during bonding.

A design support apparatus selects electrode pad arrangements on component embedded substrates based on acquired mounting board information.

Optimized multi-element solder alloy maintains structural integrity under severe temperature cycles, preventing joint cracking in automotive electronics.

A printed circuit board assembly uses a recessed insulating layer to embed flexible cables directly into conductive lines.

Vertical coil separation eliminates lateral gaps, reducing angle sensor size while preventing foreign substance intrusion.

A component mounting machine manages simultaneous nozzle pickup operations using independent negative pressure supply units.

A connection control device detects empty cavities in tape segments to automate splicing settings for component mounters.

A copper plating method uses bromide compound ions in a pre-treatment solution to deposit uniform and flat copper membranes.

Dynamic lens adjustment directs a laser beam to separate focal spots, resolving the contradiction between process complexity and pattern differentiation.

A polyamide polyamine compound acts as a leveler in electrolytic copper plating baths to control copper precipitation and enhance film uniformity.

Active particles in dielectric layers anchor conductive copper, preventing peeling during MSAP fabrication.

A component mounting system executes production cycle time simulations to compare results before and after data changes.

A thermoplastic component applies a duroplastic heat trap layer to prevent thermal damage to the substrate during soldering.

A cyanide-free gold electroplating solution deposits compact U-shaped structures inside drilled holes using specific catalyst ratios.

Optimized roughness slope and sharpness index suppress skin effect transmission loss while preventing particle detachment in high-frequency circuits.

A flexible printed circuit cover lay with a partially discontinuous contour distributes stress to prevent fractures at end portions.

A curable resin composition using high molecular weight styrene and vinyl compounds eliminates tackiness while maintaining low dielectric constants.

An organometallic corrosion protection layer shields non-noble metal chip terminals, reducing gold usage while preventing oxidation.

A checking device simulates nozzle and clamp movements to visualize spatial relationships during electronic component collection.

A feeder management system monitors stock levels and switches feeders to maintain continuous operation.

A lead-free solder composition stabilizes the beta-Sn crystal structure to prevent tin pest formation.

A flexible circuit board uses a hollowed-out cover layer region to expose an electrostatic discharge section at a through hole edge.

A Pb-free solder composition uses a Sn-Bi base metal and Ni-Fe alloy particles to form a high-melting Ni-Sn phase during hardening.

A laser cutting head separates heavy generators from movable irradiation heads to maintain precise beam alignment during glass substrate processing.

Willemite and alumina fillers in a glass matrix lower the thermal expansion coefficient of a ceramic circuit board for semiconductor wafer inspection.

An asymmetric source fan-out structure concentrates tape carrier packages to decrease printed circuit board size by one-third.

Staged cooling reduces residual thermal strain in ceramic substrates, ensuring flat surfaces for reliable metal layer adhesion.

A passivation-covered adhesive layer prevents moisture penetration at the bonding portion while enabling direct side attachment to shrink the bezel.

Identification processing verifies the tape processing unit type before extraction, preventing improper component mounting errors.

A flexible strip handle adjusts freely on the feeder body to improve operator grip and control during component loading.

A multi-element lead-free solder alloy enhances bonding strength through precise compositional tuning.

Multi-layer stopper structures form non-orthogonal cavity walls to reduce electronic component foot size.

A pressurization plate jig applies controlled pressure to adhesive members, enabling accurate measurement of attachment and separation forces.

Amine-polyacrylamide-sultone reaction products act as levelers to reduce nodule formation and improve throwing power.