Monitoring Module Cooling Device With Insulating Heat Conductor
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Solution Overview
Problem
Existing monitoring system modules face challenges in effectively cooling heat-producing components while minimizing electromagnetic field intensification and reducing production costs.
Innovation Solution
A module with a cooling device comprising a metallic and insulating heat-conducting element, where the insulating element is thermally conductive but electrically insulating, and the metallic element has a free area to prevent electromagnetic coupling, enhancing heat dissipation and enlarging the heat-emitting surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metallic cooling device is used to cool heat-producing components, then cooling power is improved, but electromagnetic field intensification occurs
Solution Approach 1:
The cooling device is divided into multiple metallic heat-conducting elements with individual free areas, segmenting the continuous metallic structure to reduce electromagnetic coupling while maintaining thermal conduction paths
Solution Approach 2:
Free areas are extracted from the metallic heat-conducting elements, creating material-free zones that prevent electromagnetic field intensification while the remaining metallic portions continue to conduct heat effectively
2Temperature
If the heat-emitting surface is enlarged to improve cooling, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The metallic heat-conducting elements serve dual functions: they conduct heat away from power components and their free areas simultaneously prevent electromagnetic field intensification, eliminating the need for separate electromagnetic shielding structures
Solution Approach 2:
The cooling device combines metallic heat-conducting elements with insulating heat-conducting elements to create a composite structure that provides both thermal conduction and electromagnetic field management in a single integrated component
3Temperature
If conventional cooling devices are used, then cooling function is provided, but production costs increase
Solution Approach 1:
The metallic heat-conducting elements perform multiple functions (heat conduction and electromagnetic field prevention) simultaneously, reducing the total component count and assembly complexity, which lowers production costs
Solution Approach 2:
The cooling device merges thermal management and electromagnetic field management functions into a single integrated structure, eliminating the need for separate cooling components and electromagnetic shielding elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces electromagnetic field intensification, improves cooling power, and lowers production costs by using a combination of heat-conducting elements to dissipate thermal energy efficiently.
Implementation Method 1
The insulating heat-conducting element is coupled thermally to the electromagnetic radiating component and to the metallic heat-conducting element, so that a transfer of heat between the insulating heat-conducting element, the electromagnetic radiating component and the metallic heat-conducting element is implemented
Implementation Method 2
The cooling device is used to dissipate the thermal energy to the surroundings, wherein the thermal energy is in particular dissipated to the surroundings via thermal radiation and/or convection
Implementation Method 3
The cooling device is used to dissipate the thermal energy to the surroundings, wherein the thermal energy is in particular dissipated to the surroundings via thermal radiation and/or convection
Implementation Method 4
the metallic element has a free area to prevent electromagnetic coupling, enhancing heat dissipation and enlarging the heat-emitting surface
Implementation Method 5
The insulating heat-conducting element is coupled thermally to the electromagnetic radiating component and to the metallic heat-conducting element, so that a transfer of heat between the insulating heat-conducting element, the electromagnetic radiating component and the metallic heat-conducting element is implemented
Data Source
Figure 1~2
Figure 3
AI summary
The invention proposes a module 4, having a main circuit board 7, wherein the main circuit board 7 has a printed circuit board 8 and at least one electromagnetic radiating component 9, wherein the electromagnetic radiating component 9 is arranged on the printed circuit board 8 and being contacted via at least one conductor track, having a cooling device 12 for cooling the electromagnetic radiating component 9, wherein the cooling device 12 being coupled thermally to the electromagnetic radiating component 9, so that a transfer of heat between the cooling device 12 and the electromagnetic radiating component 9 is implemented, wherein the cooling device 12 has at least one metallic heat-conducting element 13 and an insulating heat-conducting element 14, wherein the metallic heat-conducting element 13 has a free area 15, wherein the electromagnetic radiating component 9 and the insulating heat-conducting element 14 is arranged at least in sections in the free area 15, wherein the electromagnetic radiating component 9 is coupled thermally to the metallic heat-conducting element 13 via the insulating heat-conducting element 14, so that an electromagnetic coupling path between the metallic heat-conducting element 13 and the electromagnetic radiating component 9 is reduced.