Circuit Board Dielectric Layer Active Particles Adhesion
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Solution Overview
Problem
In the modified semi-additive process (MSAP) for circuit board manufacturing, the adhesive strength between the copper layer and the dielectric layer is poor due to the thinness and low roughness of the copper foil, leading to potential peeling issues during fabrication, which reduces the reliability and wiring density of the circuit board.
Innovation Solution
Incorporating active particles, such as metal complexes, into the dielectric layer and performing surface treatments to expose these particles, allowing for the formation of a first conductive layer with lower thickness and roughness that effectively adheres to the dielectric layer, thereby increasing adhesive strength and preventing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If ultra-thin copper foil with low roughness is used in MSAP, then wiring density can be increased, but adhesive strength between copper layer and dielectric layer deteriorates
Solution Approach 1:
The patent introduces active particles (such as metal complexes or metal oxides) as intermediary substances within the dielectric layer. These particles serve as a mediator between the ultra-thin copper foil and the dielectric substrate, providing anchoring points that enhance adhesive strength without requiring thicker or rougher copper foil, thus maintaining high wiring density while preventing peeling
Solution Approach 2:
The patent modifies the dielectric layer by incorporating active particles with specific surface energies and chemical properties. This changes the surface parameters of the dielectric layer to be more compatible with copper foil, improving wetting and adhesion. The active particles create chemical bonds or strong physical interactions with the copper foil, enhancing adhesive strength while keeping the copper foil thickness minimal for high wiring density
2Manufacturing precision
If copper foil thickness is reduced further, then wiring density increases, but reliability deteriorates due to peeling during fabrication
Solution Approach 1:
The active particles act as a reinforcement intermediary between the ultra-thin copper foil and the dielectric substrate. These particles are distributed within the dielectric layer and exposed at the interface with the copper foil, creating multiple anchoring points that prevent peeling even when the copper foil is extremely thin, thus maintaining reliability while achieving high wiring density
Solution Approach 2:
The dielectric layer is pre-treated by incorporating and exposing active particles before the copper foil is deposited. This preliminary preparation ensures that the interface is already optimized for adhesion, preventing peeling issues during subsequent fabrication steps. The active particles are positioned in advance to provide continuous anchoring support throughout the fabrication process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced adhesive strength between the conductive and dielectric layers enables the production of circuit boards with finer line widths, meeting high wiring density demands without reducing reliability, as evidenced by increased tensile strength and reduced risk of layer separation.
Implementation Method 1
the surface treatment is, for example, plasma processing or chemical solution cleaning processing
Implementation Method 2
the surface treatment is, for example, plasma processing or chemical solution cleaning processing
Implementation Method 3
the adhesive strength between the circuit layer and the dielectric layer is poor
Implementation Method 4
the material of the active particles is metal complexes
Data Source
AI summary
A circuit board and a manufacturing method thereof are provided. According to the method, a dielectric layer is formed on a dielectric substrate, and the dielectric layer contains active particles. A surface treatment is performed on a surface of the dielectric first conductive layer is formed on the activated surface of the dielectric layer. A conductive via is formed in the dielectric substrate and the dielectric layer. A patterned mask layer is formed on the first conductive layer, in which the patterned mask layer exposes the conductive via and a part of the first conductive layer. A second conductive layer is formed on the first conductive layer and conductive via exposed by the patterned mask layer. The patterned mask layer and the first conductive layer below the patterned mask layer are removed.