Laser Cutting Head Segmentation for Glass Substrate Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing glass substrate cutting methods, such as the scribe wheel method and prior art laser cutting systems, face issues with stability, precision, and increased costs due to positional distortion of the laser beam path when the gantry structure sinks under the weight of heavy laser cutting heads, and require separate cleaning and drying processes, leading to reduced productivity and larger layout spaces.
Innovation Solution
A glass substrate cutting apparatus using a laser with a gantry structure that separates the laser cutting head into two parts, where the heavy-weighted laser beam generators are fixed to the gantry structure and the lighter laser irradiation heads move horizontally, minimizing positional distortion and allowing for precise control of the cutting process without the need for table transfer methods, thus reducing cycle time and layout space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the laser cutting head moves as a whole including heavy laser beam generators, then the cutting head can be repositioned for different cutting locations, but the gantry structure sinks causing positional distortion of laser beam path and deterioration of cutting stability
Solution Approach 1:
The laser cutting head is divided into two parts: heavy laser beam generators that remain fixed on the gantry structure, and lighter laser irradiation heads that move horizontally along the gantry. This segmentation allows the heavy components to stay stationary (preventing gantry sinking) while the lighter components provide repositioning capability for different cutting locations.
2Reliability
If the cutting table is moved instead of the laser cutting head, then the laser cutting head remains fixed maintaining cutting stability, but the layout area increases and cycle time increases due to table return time
Solution Approach 1:
The system segments the cutting head into fixed heavy components and movable light components, allowing the movable part to be repositioned quickly without moving the entire cutting table. This eliminates the need for table return time while maintaining cutting stability through the fixed laser beam generators.
3Speed
If the laser cutting head is made lighter to enable movement, then the gantry structure stability is maintained, but the laser beam generation capability is compromised
Solution Approach 1:
The system separates the heavy laser beam generators (providing power) from the lighter laser irradiation heads (enabling movement). The heavy components stay fixed to maintain gantry stability and provide sufficient laser power, while the lighter components can move quickly along the gantry to different cutting positions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances cutting stability and precision, reduces cycle time, and eliminates the need for separate cleaning and drying processes, resulting in improved productivity and reduced costs by maintaining the glass substrate in a horizontal state and using a rotating device to prevent damage from foreign substances during the cutting process.
Implementation Method 1
laser beam generators, each including a heavy-weighted laser oscillation source and a power supply part
Implementation Method 2
irradiating laser configured to oscillate from the laser beam generators (100) upon the glass substrate
Implementation Method 3
a quenching nozzle... for separating a laser cutting head into two parts including laser beam generators and laser irradiation heads
Data Source
AI summary
Glass substrate cutting apparatuses using lasers are disclosed, where a laser cutting head is moved. A glass substrate cutting apparatus includes two parts for a laser cutting head: heavy laser beam generators fixed to respective ends of a gantry structure moving in parallel along two gantry stages located on either side of a cutting table, and relatively lightweight laser irradiation heads moving horizontally in parallel with the gantry structure. The glass substrate cutting apparatus includes a cutting table for maintaining a glass substrate in a horizontal state; biaxial gantry stages for moving a gantry structure along the cutting table; the gantry structure moving in between an upper part of the biaxial gantry stages; laser beam generators fixed to respective ends of the gantry structure for oscillating the laser; and laser irradiation heads that move horizontally on respective ends of the gantry structure and irradiate the laser upon the glass substrate.