Polyamide Polyamine Leveler for Circuit Board Plating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrolytic copper plating baths struggle to simultaneously achieve sufficient plugging performance for blind via holes and covering power for through holes in circuit boards with both features, often resulting in thin film thickness issues that lead to corner cracks or incomplete filling.
Innovation Solution
An electrolytic copper plating bath containing a polyamide polyamine compound, prepared by heating an epichlorohydrin modified product of diethylene triamine, adipic acid, and ε-caprolactam, along with water-soluble copper salts, sulfuric acid, and chloride ions, which acts as a leveler to enhance copper precipitation and prevent corner cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating bath aimed at via-filling is used, then plugging performance for blind via holes is improved, but covering power for through holes deteriorates (thin film thickness at corners)
Solution Approach 1:
The invention changes the chemical parameters of the plating bath by introducing a specific polyamide polyamine compound with controlled molecular weight (1,000-10,000) and specific structural characteristics (straight-chained, free from quaternary nitrogen and tertiary amide structures). This parameter change enables the bath to simultaneously achieve via-filling and through-hole plating performance
Solution Approach 2:
The plating bath uses a composite chemical system combining water-soluble copper salt, sulfuric acid, chloride ions, and the specifically structured polyamide polyamine compound. This composite formulation creates synergistic effects that resolve the contradiction between via-filling and through-hole plating
2Manufacturing precision
If a plating bath aimed at through hole plating is used, then covering power for through holes is improved, but plugging performance for blind via holes deteriorates (thin film thickness at inner bottom)
Solution Approach 1:
The invention modifies the plating bath parameters by using a polyamide polyamine compound with specific molecular weight range (1,000-10,000) and unique structural features (straight-chained configuration, absence of quaternary nitrogen and tertiary amide groups). These parameter changes enable simultaneous optimization of through-hole covering and via-hole filling
Solution Approach 2:
The plating bath employs a composite chemical system integrating water-soluble copper salt, sulfuric acid, chloride ions, and the specifically structured polyamide polyamine compound. This composite creates synergistic effects that resolve the contradiction between through-hole plating and via-hole filling performance
3Productivity
If conventional plating baths are used for simultaneous via-filling and through-hole plating, then processing efficiency is improved, but film quality deteriorates (corner cracks or incomplete filling)
Solution Approach 1:
The invention changes critical bath parameters by incorporating a polyamide polyamine compound with precisely controlled molecular weight (1,000-10,000) and specific structural characteristics. This enables simultaneous via-filling and through-hole plating in a single step without corner cracks or incomplete filling
Solution Approach 2:
The plating bath uses a composite formulation combining water-soluble copper salt, sulfuric acid, chloride ions, and the specifically structured polyamide polyamine compound. This composite system achieves both high productivity through simultaneous plating and high film quality without defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective plating of both blind via holes and through holes with improved plugging performance and covering power, preventing corner cracks and ensuring complete filling without voids, while maintaining optimal copper precipitation suppression.
Implementation Method 1
electrolytic copper plating bath containing a water-soluble copper salt, sulfuric acid and chloride ions
Implementation Method 2
a polyamide polyamine compound... as a leveler... to enhance copper precipitation
Data Source
AI summary
For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ε-caprolactam, is contained in the bath as a leveler.