Component Embedded Substrate Pad Arrangement Optimization
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Solution Overview
Problem
Conventional substrate design apparatuses do not adequately optimize the terminal arrangement of subordinate substrates or components on them, particularly in multi-chip module (MCM) and chip size package (CSP) designs, which complicates the wiring connections between semiconductor chips and other components.
Innovation Solution
A design support apparatus and method that acquires component information, pad information, and mounting arrangement information to optimize the arrangement of electrode pads on a component embedded substrate, considering the arrangement on a mounting board, thereby optimizing pin arrangement design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional substrate design apparatuses are used for MCM and CSP designs, then the basic substrate design can be completed, but the terminal arrangement of subordinate substrates is not optimized, leading to complicated wiring connections
Solution Approach 1:
The invention performs preliminary optimization of terminal arrangement on subordinate substrates before the actual wiring design process. By determining optimal terminal positions in advance based on component locations and connection requirements, the system prevents wiring complexity from escalating during later design stages.
Solution Approach 2:
The system dynamically adjusts terminal arrangement parameters by considering multiple factors including component positions, connection requirements, and wiring length constraints. This parameter optimization reduces wiring complexity while maintaining manufacturing feasibility.
2Adaptability or versatility
If electrode pad arrangement is not optimized considering mounting board arrangement, then design process is simpler, but design flexibility and connection efficiency are reduced
Solution Approach 1:
The invention implements a feedback mechanism where mounting board arrangement information is fed back to the pad arrangement selection process. This allows the system to iteratively refine pad positions based on how components are ultimately arranged on the mounting board, enhancing design flexibility without excessive complexity.
Solution Approach 2:
The pad arrangement is made dynamic rather than fixed, allowing it to adapt based on mounting board configuration. The system can adjust pad positions according to different mounting scenarios while maintaining a manageable process through automated selection algorithms.
3Manufacturing precision
If manual optimization of terminal and pad arrangement is performed, then optimal design can be achieved, but design time and productivity are significantly reduced
Solution Approach 1:
The system performs self-service optimization by automatically determining optimal terminal and pad arrangements without requiring extensive manual intervention. The automated algorithms evaluate multiple configurations and select optimal arrangements, maintaining high design quality while significantly improving productivity.
Solution Approach 2:
The invention replaces manual mechanical optimization processes with automated computational algorithms. This substitution maintains or improves terminal arrangement quality while eliminating the time-consuming nature of manual optimization, thereby enhancing design efficiency.
Data Source
AI summary
A design support apparatus supports design of a component embedded substrate including an embedded electronic component that configures at least a part of a circuit. The apparatus includes a component information acquiring unit that acquires component information containing component identifying information about the electronic component to be incorporated in the substrate, a pad information acquiring unit that acquires pad information about a type and number of electrode pads to be arranged on the substrate based on the component information, a mounting arrangement information acquiring unit that acquires mounting arrangement information about the arrangement of the substrate and another component on a mounting board in which the component embedded substrate is to be incorporated, and a pad arrangement selecting unit that selects the arrangement of the electrode pad on a surface of the substrate based on the mounting arrangement information and the pad information.