Thermoplastic Component Heat Trap Layer for Soldering
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Solution Overview
Problem
Thermoplastic plastic components with metal layers applied via soldering methods face damage due to high temperatures, leading to impaired bonding and potential detachment of the metal layer, especially when using softening thermoplastic polymers, which are costly and difficult to produce.
Innovation Solution
A thermoplastic synthetic component with a 'heat trap' layer of duroplastic or highly heat-resistant thermoplastic synthetic materials applied via serigraphy, roller coating, or spraying, which protects against thermal damage during soldering by slowing temperature penetration to the substrate, allowing for secure electrical contacting without damaging the base material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thermoplastic polymers are used to form plastic components, then the components are simple to process and cost-effective, but the polymer substance is damaged by high temperatures during soldering, leading to impaired bonding and detachment of metal layer
Solution Approach 1:
The plastic component is segmented into two distinct layers: a base layer of conventional thermoplastic material and a protective layer of heat-resistant thermoplastic material. This segmentation allows each layer to perform its specific function - the base layer provides cost-effective processing while the protective layer ensures bonding integrity during soldering.
Solution Approach 2:
The invention uses a composite material structure combining conventional thermoplastic and heat-resistant thermoplastic materials in a layered configuration. This composite approach allows the component to exhibit both the processing advantages of conventional thermoplastics and the thermal resistance of specialized materials.
2Reliability
If highly heat-resistant plastics are used to prevent detachment and achieve good adhesion of surface metallization, then the bonding integrity is improved, but the production effort and material costs increase significantly
Solution Approach 1:
The protective heat-resistant layer is applied selectively only in regions where metal layer bonding is required, rather than using it throughout the entire component. This local application reduces material costs and production effort while maintaining bonding integrity where needed.
Solution Approach 2:
The invention changes the thermal parameter profile of the plastic component by adding a heat-resistant layer, allowing the use of conventional thermoplastic base materials while achieving the thermal performance of specialized materials during soldering processes.
3Object-affected harmful factors
If a protective layer of heat-resistant material is applied on the thermoplastic substrate, then thermal damage during soldering is prevented, but the device complexity and production steps increase
Solution Approach 1:
The protective heat-resistant layer and the base thermoplastic layer are combined into a single integrated component structure, where the protective layer is applied directly to the substrate. This merging eliminates the need for separate protective measures and simplifies the overall device structure.
Solution Approach 2:
The heat-resistant protective layer is applied in advance during the manufacturing process, before the soldering operation. This preliminary action ensures that the substrate is already protected when exposed to high temperatures during subsequent soldering steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective and secure electrical contacting of additional elements by preventing thermal damage to the substrate material, using thin layers (5-75 μm) that can be applied over large areas or selectively, maintaining the thermoplastic character for recycling and reducing material costs.
Implementation Method 1
The duroplastic synthetic or the highly heat-resistant synthetic is not damaged by the increased temperature upon soldering. The temperature penetration to the substrate material, thus the commercially available thermoplastic synthetic, is slowed; only a slight heating of the substrate material occurs that in no case leads to a damaging.
Data Source
AI summary
A plastic component with a metal layer applied to the surface for electrical contacting of electrical elements ensuing in a thermal attachment method, particularly in a soldering method, has a layer composed of a duroplastic synthetic or a highly heat-resistant thermoplastic synthetic, on which layer a metal layer is applied, applied on the component carrier made of a thermoplastic synthetic, at least in the region of the contacting point or points. The duroplastic synthetic is a hardened resin, and the resin layer is generated by application of the liquid resin by serigraphy, roller coating or spraying, or the highly heat-resistant thermoplastic synthetic is applied in the form of a film.