Conductive Ink Patterns for Display Device Bonding
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Solution Overview
Problem
The challenge in display device manufacturing is to minimize dead space and the impact on the display panel during bonding, while also preventing short circuits and enhancing manufacturing efficiency, particularly in the context of miniaturization and high-density applications where traditional heating and pressure methods are undesirable.
Innovation Solution
A display device design featuring a first substrate with a thin film transistor, pad electrodes on the lower surface, and a second substrate with an opening exposing these electrodes, where a circuit board is attached with conductive ink patterns that cover the bump and pad electrodes, providing electrical connection and minimizing contact area, along with a non-conductive film and barrier layer for hydrophilic and hydrophobic surface treatments to optimize bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional bonding methods using heat and pressure are used to attach the circuit board to the display panel, then strong bonding and reliable electrical connection are achieved, but dead space increases and the display panel is damaged
Solution Approach 1:
The patent replaces the traditional mechanical bonding system (heat and pressure) with a chemical bonding system using anisotropic conductive film. The ACF forms bonds through controlled heating and pressing, but the key innovation is the use of conductive ink patterns that create electrical connections without requiring extensive heat and pressure, thereby reducing dead space while maintaining bonding reliability
Solution Approach 2:
The patent introduces a new dimension of solution by using conductive ink patterns that extend in multiple directions from the pad electrodes. These ink patterns create a three-dimensional bonding interface that allows for reduced contact area while maintaining electrical connectivity, effectively reducing dead space without compromising reliability
2Reliability
If traditional bonding methods using heat and pressure are used to attach the circuit board to the display panel, then strong bonding is achieved, but the display panel is damaged
Solution Approach 1:
The patent replaces the traditional mechanical bonding system (heat and pressure) with a chemical bonding system using anisotropic conductive film. The ACF forms bonds through controlled heating and pressing, but the key innovation is the use of conductive ink patterns that create electrical connections without requiring extensive heat and pressure, thereby reducing dead space while maintaining bonding reliability
Solution Approach 2:
The patent changes the bonding parameters by introducing a new material (anisotropic conductive film) that enables bonding at lower temperatures and pressures compared to traditional methods. The conductive ink patterns are designed with specific physical and chemical properties that allow for reduced thermal and mechanical stress on the display panel while maintaining bonding strength
3Reliability
If the contact area between the circuit board and pad electrodes is increased to ensure reliable electrical connection, then bonding reliability is improved, but dead space increases
Solution Approach 1:
The patent introduces a new dimension of solution by using conductive ink patterns that extend in multiple directions from the pad electrodes. These ink patterns create a three-dimensional bonding interface that allows for reduced contact area while maintaining electrical connectivity, effectively reducing dead space without compromising reliability
Solution Approach 2:
The patent applies local quality by designing conductive ink patterns with varying properties in different regions. The ink patterns have different conductivities, thicknesses, and shapes in different areas to optimize both electrical connection and contact area reduction, allowing reliable bonding with minimal dead space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces dead space, minimizes the impact on the display panel, prevents short circuits, and maximizes manufacturing efficiency by using conductive ink patterns to connect the circuit board and pad electrodes, ensuring reliable and efficient bonding without the need for heat and pressure.
Implementation Method 1
The plurality of conductive ink patterns may cover at least a portion of the bump and the pad electrode, and electrically connect the bump and the pad electrode to each other
Implementation Method 2
A display device may further include a non-conductive film disposed between the bump and the pad electrode
Implementation Method 3
The lower surface of each of the pad electrodes may be hydrophilic, and the lower surface of the first substrate adjacent to the pad electrode may be hydrophobic
Data Source
AI summary
A display device includes a first substrate; a thin film transistor disposed on an upper surface of the first substrate; a plurality of pad electrodes disposed under a lower surface of the first substrate; a second substrate disposed under the lower surface of the first substrate and defining an opening therein exposing the plurality of pad electrodes; a circuit board attached onto the plurality of pad electrodes exposed through the opening of the second substrate; and a plurality of conductive ink patterns surrounding at least a side surface of the circuit board and being in contact with at least one of the plurality of pad electrodes, where lower surfaces of the plurality of conductive ink patterns each have a shape having a concave central portion.