Adhesive-Layer Structure for Low-Stress Micro LED Replacement
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Solution Overview
Problem
The existing methods for manufacturing micro light-emitting element display panels face challenges in replacing defective micro light-emitting elements, leading to reduced production yield and increased costs due to the need for high ambient temperatures to bond and replace these elements, which affects the remaining elements and limits bonding stress.
Innovation Solution
The use of an adhesive-layer structure with a buffer layer and a mending adhesive layer, where the buffer layer has a lower glass transition temperature than the adhesive layer, allows for targeted mending of defective micro light-emitting elements with reduced stress on other elements, improving replacement success rates and production yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high ambient temperature is used to bond and replace micro light-emitting elements, then bonding strength is improved, but remaining elements are affected and production yield decreases
Solution Approach 1:
The adhesive layer is segmented into two distinct layers: a first adhesive layer for initial bonding and a second adhesive layer (mending adhesive layer) for replacement operations. This segmentation allows each layer to have optimized properties for its specific function, enabling replacement without affecting other elements.
Solution Approach 2:
The second adhesive layer is applied locally only at positions where defective elements need replacement, rather than uniformly across the entire substrate. This localized application ensures that bonding operations are confined to specific areas, preventing thermal or mechanical effects from propagating to other elements.
2Force
If high ambient temperature is used for bonding, then bonding stress is increased, but bonding stress on other elements is limited
Solution Approach 1:
The adhesive system is divided into two layers with different functional characteristics. The first adhesive layer provides initial bonding with moderate stress, while the second adhesive layer enables targeted stress application during replacement without transmitting excessive stress to surrounding elements.
Solution Approach 2:
By applying the second adhesive layer only at defect locations, bonding stress is concentrated locally where needed. This prevents the propagation of high stress to other elements, solving the contradiction between achieving sufficient bonding stress and protecting other elements from harmful stress effects.
3Ease of manufacture
If traditional single-layer adhesive structure is used, then manufacturing process is simple, but replacement success rate of defective elements is low
Solution Approach 1:
The adhesive layer is divided into two functional segments: the first adhesive layer for initial element attachment and the second adhesive layer for controlled replacement. This segmentation enables successful replacement operations by providing a dedicated mending layer that can be selectively applied and removed without compromising the integrity of other bonded elements.
Solution Approach 2:
The second adhesive layer acts as an intermediary medium that facilitates the replacement process. It provides a controlled bonding interface that allows defective elements to be removed and replaced with new ones, thereby improving replacement success rate while maintaining a relatively simple manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the replacement success rate of defective micro light-emitting elements and maintains a high production yield by using a buffer layer to bond with the mending adhesive layer and the micro light-emitting element, allowing for efficient and stress-reduced bonding processes.
Implementation Method 1
The buffer layer is disposed between the adhesive layer and the micro light-emitting element
Implementation Method 2
a glass transition temperature of the buffer layer is lower than a glass transition temperature of the adhesive layer
Data Source
AI summary
A semiconductor structure disposed on a temporary carrier board is provided. Multiple adhesive layers are disposed on the temporary carrier. The semiconductor structure includes an adhesive-layer structure and a micro light-emitting element. The adhesive-layer structure includes a mending adhesive layer and a buffer layer. The mending adhesive layer is disposed on the temporary carrier board. The micro light-emitting element is disposed on the mending adhesive layer. The buffer layer is disposed between the mending adhesive layer and the micro light-emitting element. A height of the mending adhesive layer is less than a height of each of the adhesive layers in a thickness direction of the temporary carrier board. A sum of the height of the mending adhesive layer and the height of the buffer layer is greater than or equal to a height of each of the adhesive layers.