Adhesive Layer Fabrication for Semiconductor Substrate Mounting
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Solution Overview
Problem
The complexity and damage to semiconductor chips during the process of stacking and removing carrier glue layers in semiconductor device fabrication, leading to increased fabrication complexity and potential defects.
Innovation Solution
A method involving the use of an adhesive layer on a semiconductor substrate, where a carrier substrate is attached using a release layer, allowing for the removal of the carrier substrate without damaging the adhesive layer, thereby omitting the need for chemical treatment and preventing residue formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a carrier glue layer is used to attach the semiconductor wafer to the carrier substrate, then the semiconductor wafer can be securely mounted, but the removal process causes damage to solder balls and leaves residue
Solution Approach 1:
The adhesive system is segmented into two distinct layers: a lower adhesive layer that bonds the semiconductor wafer to the carrier substrate, and an upper release layer that facilitates clean separation. This segmentation allows the mounting function and removal function to be independent, enabling reliable mounting without damage during removal.
Solution Approach 2:
The release layer acts as an intermediary between the adhesive layer and the external removal process. It mediates the separation process by providing a controlled interface that allows the carrier substrate to be removed without directly interacting with and damaging the solder balls or leaving residue on the semiconductor wafer.
2Ease of operation
If chemical treatment is used to remove the carrier glue layer, then the carrier substrate can be separated, but the process complexity increases and solder balls may be damaged
Solution Approach 1:
The chemical removal process is replaced with a mechanical separation process. The release layer is designed to allow clean mechanical separation from the adhesive layer, eliminating the need for chemical treatments and their associated complexity and risks to solder balls.
3Productivity
If the carrier substrate is removed after mounting, then the semiconductor wafer can be processed independently, but the adhesive layer may be damaged or residue may remain
Solution Approach 1:
The release layer is applied preliminarily over the adhesive layer before mounting. This preliminary action prepares the system for clean separation, ensuring that when the carrier substrate is removed for independent processing, the adhesive layer remains intact without damage or residue.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This simplifies the semiconductor device fabrication process, prevents damage to connection terminals, and enhances the reliability of the semiconductor device by stabilizing the substrate during processing and eliminating defects from carrier glue layer removal.
Implementation Method 1
coating a wafer with a thermosetting polymer layer
Implementation Method 2
the release layer is removed while the release layer is attached to the carrier substrate to expose the thermosetting polymer layer
Data Source
AI summary
A method of fabricating a semiconductor device is provided in which an adhesive layer is disposed on a first surface of a first semiconductor substrate. A carrier substrate is provided on the first surface of the first semiconductor substrate, and the carrier substrate is separated from a surface of the adhesive layer while the adhesive layer is still attached to the first surface of the first semiconductor substrate.