Adhesive Loop Protrusions for Image Sensor Flare Reduction
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Solution Overview
Problem
Conventional image sensing chip package structures experience reduced sensitivity due to flare caused by reflected light rays when the refractive index changes from air to the light-transmissible substrate, affecting the image sensing region's performance.
Innovation Solution
The image sensing chip package structure features adhesive loops with protrusions on a light-transmissible substrate, which scatter incoming light to minimize flare, comprising forming adhesive loops with protrusions on the substrate, connecting chips to these loops, and dicing the substrate to create individual package structures with each chip's image sensing region surrounded by the protrusions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a light-transmissible substrate member is used to cover the image sensing region, then light transmission to the image sensing region is enabled, but reflected light rays cause flare that adversely affects sensitivity
Solution Approach 1:
The adhesive loop material, which normally would reflect light and cause flare, is intentionally designed with high reflectivity properties to function as a flare prevention structure. The reflective surface is positioned to redirect reflected light away from the image sensing region, converting the harmful reflection effect into a beneficial flare-prevention mechanism while maintaining light transmission coverage.
Solution Approach 2:
The adhesive loop serves as an intermediary element between the light-transmissible substrate member and the image sensing region. By positioning the reflective surface of the adhesive loop at a specific location, it acts as a mediator that intercepts and redirects reflected light rays before they can reach the image sensing region, thus preventing flare while allowing the substrate to maintain its light transmission function.
2Strength
If a conventional adhesive member is used to connect the substrate to the chip, then structural support is provided, but it does not effectively prevent flare
Solution Approach 1:
The adhesive loop is designed to perform multiple functions simultaneously: it provides structural support by connecting the light-transmissible substrate member to the chip (adhesive function), and it prevents flare by incorporating a reflective surface that redirects reflected light away from the image sensing region (flare prevention function). This multi-functional design eliminates the need for separate flare prevention structures.
Solution Approach 2:
The adhesive loop is constructed as a composite structure combining adhesive material with a reflective surface. This composite design integrates the bonding properties of adhesive materials with the optical properties of reflective surfaces, enabling the single component to fulfill both structural support and flare prevention requirements effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces flare in the image sensing region by scattering light, thereby enhancing the sensitivity and performance of the image sensing chip package structures.
Implementation Method 1
The adhesive loop has an inner peripheral surface that defines a plurality of protrusions which surround the image sensing region of the chip... effectively reduces flare in the image sensing region by scattering light
Data Source
AI summary
An image sensing chip package structure includes a chip, an adhesive loop and a light-transmissible substrate member. The chip includes an image sensing region. The adhesive loop is connected to the chip, and has an inner peripheral surface that defines a plurality of protrusions which surround the image sensing region of the chip. The light-transmissible substrate member is connected to the adhesive loop oppositely of the chip to cover the image sensing region of the chip. Methods of manufacturing the image sensing chip package structures are also provided.