Wiring-Attached Adhesive Substrate for Crack-Free Printed Wiring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing techniques for forming wiring patterns on adhesive layers in electronic devices face challenges such as increased manufacturing steps, use of auxiliary materials, and issues like cracking and buckling of the wiring pattern.
Innovation Solution
A wiring-attached adhesive substrate is developed, featuring a substrate with an adhesive layer that has specific properties, including high adhesive strength, controlled layer thickness variation when immersed in solvents, and a wiring pattern formed using conductive ink materials via techniques like inkjet or screen printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a transfer technique is used to form wiring on the adhesive layer, then the wiring pattern can be formed, but the number of manufacturing steps increases and auxiliary materials increase
Solution Approach 1:
The invention extracts and eliminates the transfer film from the manufacturing process. Instead of forming wiring patterns on a transfer film and then transferring them to the adhesive layer, the wiring patterns are formed directly on the adhesive layer itself, removing the intermediate transfer step and reducing manufacturing complexity
Solution Approach 2:
The adhesive layer is prepared in advance with controlled thickness and properties before wiring pattern formation. By pre-establishing the adhesive layer with specific characteristics (thickness variation ≤20% in isopropyl alcohol, ≤18% in toluene), the substrate is ready for direct wiring formation without requiring subsequent transfer operations
2Manufacturing precision
If a transfer technique is used to form wiring on the adhesive layer, then the wiring pattern can be formed, but the wiring pattern may collapse during transfer
Solution Approach 1:
The transfer film and transfer process are completely removed from the system. The wiring pattern is formed directly on the adhesive layer using printing methods, eliminating the mechanical transfer step that causes pattern collapse and improving wiring pattern reliability
Solution Approach 2:
The adhesive layer itself serves as the direct substrate for wiring pattern formation, acting as an integrated intermediary between the substrate and the wiring. This eliminates the need for a separate transfer film mediator, preventing pattern collapse during transfer
3Productivity
If the wiring pattern is directly formed on the adhesive layer, then the number of manufacturing steps is reduced, but crack and buckling occur in the formed wiring
Solution Approach 1:
The invention changes the physical and chemical parameters of the adhesive layer, specifically controlling its thickness variation to ≤20% in isopropyl alcohol and ≤18% in toluene. This parameter optimization prevents excessive swelling or shrinking that would cause crack and buckling, enabling direct wiring formation with high quality
Solution Approach 2:
The adhesive layer is engineered with uniform local properties throughout, ensuring consistent thickness and swelling behavior across the entire surface. This local quality control prevents differential swelling that would cause wiring pattern deformation, cracking, or buckling
4Manufacturing precision
If the adhesive layer has high solvent resistance, then layer thickness variation is reduced, but adhesive strength may be compromised
Solution Approach 1:
The invention optimizes the adhesive layer composition and structure to achieve a balance point where solvent resistance and adhesive strength are both maximized. By controlling thickness variation within specific ranges (≤20% in isopropyl alcohol, ≤18% in toluene), the adhesive layer maintains dimensional stability while preserving bonding capability
Solution Approach 2:
The adhesive layer is formulated as a composite material system that combines solvent resistance with adhesive functionality. This composite structure allows the layer to resist solvent penetration and maintain thickness stability while simultaneously providing sufficient adhesive strength for bonding
Data Source
AI summary
To provide a wiring-attached adhesive substrate that can suppress the occurrence of crack and buckling in the wiring pattern formed on the adhesive layer. The wiring-attached adhesive substrate according to one aspect of the present disclosure comprises a substrate, an adhesive layer formed on the substrate, and a wiring pattern formed on the adhesive layer. The adhesive layer has an adhesive strength of 0.01 N/25 mm or more to a PET film, layer thickness variation when the adhesive layer is immersed in isopropyl alcohol for 1 minute is 20% or less, and layer thickness variation when the adhesive layer is immersed in toluene for 1 minute is 18% or less.