Conductive Layers On Insulating-Supports TRIZ Cases
- Copper-Clad Laminate Film Tie Layer for High-Frequency Adhesion
A metal tie layer with strong metal-oxygen bonding improves high-frequency dielectric behavior while preserving coatability and copper adhesion.
- Grid Interconnect Layout for Precise Flat Cable Splicing
A severable conductive grid on a flexible dielectric substrate enables precise, scalable flat cable splicing without slow soldering or crimping.
- Nickel Temperature Sensor Film With Chromium Oxide Adhesion Layer
A chromium oxide underlayer helps nickel temperature sensor films survive heat treatment, improving adhesion while raising TCR for accuracy.
- Wiring-Attached Adhesive Substrate for Crack-Free Printed Wiring
Controlled solvent swelling and PET adhesion let wiring print directly on an adhesive layer without transfer-induced cracking or buckling.
- Silver Nanowire Transparent Electrode for Low-Temperature Conductivity
Curved silver nanowires joined by a low-boiling alkynyl-hydroxy compound cut contact resistance while preserving transparency and flexibility.
- High-Chromaticity Pigment Flakes With Liquid-Coated Dielectric Layers
Liquid-coated dielectric layers with photo-initiators improve adhesion and optical effects in security pigment flakes while cutting process cost.
- Crosslinkable Copolymer Films for High-Yield Nanostructure Transfer
Crosslinked copolymer films improve adhesion during nanostructure transfer, enabling near-100% yield for narrow, ultrathin ribbons.
- Fluorinated Copolymer Composition for Filler Dispersion Stability
A fluorinated amide copolymer disperses inorganic filler while preserving oxidation resistance and stable viscosity over time.
- Conductive Ink Composition for Localized Open-Circuit Repair
Photothermal ink locally converts light to heat to reduce metal ions and repair fine-pattern disconnections without vacuum equipment.
- Electron-Beam Doped Carbon Nanomaterial Electrodes for Low Sheet Resistance
Electron beam irradiation dopes carbon nanomaterial films in seconds, cutting sheet resistance while preserving transparency and large-area uniformity.
- ITO-Ag Multilayer Structure With Polymer Binder for Peel Resistance
A polymer binder layer between ITO and Ag improves adhesion, prevents peeling under deformation, and keeps multilayer conductivity stable.
- Indium-Oxide Electrode Patterning for Ultra-High-Resolution Displays
Spatial indium variation and two-step plasma etching sharpen transparent electrode patterns for efficient ultra-high-resolution display manufacturing.
- Metal Nanowire Conductive Composition for Flexible Transparent Electrodes
Metal nanowires with a cross-linkable compound improve conductivity, stability, and surface smoothness for flexible transparent electrodes.
- Low-Loss Copolymer-Silica Composition for Heat-Resistant Cured Insulators
A copolymer and surface-treated silica balance low dielectric loss with 250°C modulus retention for high-frequency insulating substrates.
- Silver-Tin-Silver Coated Resin Particles for Heat-Cycle Adhesion
A tin intermediate layer between silver coatings helps resin particles resist heat-cycle peeling while preserving conductive film conductivity.
- Breathable Fabric Capacitive Strain Sensor for Wearable Motion Capture
Porous adhesive and breathable fabric layers enable a stretchable capacitive sensor garment that captures motion accurately without sacrificing comfort.
- Transparent Conductive Film Crystallization on Polymer Substrates
Light radiation crystallizes indium oxide on polymer substrates to achieve low resistivity and high transmittance without heat damage.