Grid Interconnect Layout for Precise Flat Cable Splicing
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Solution Overview
Problem
Existing methods for interconnecting flat electrical cables, such as soldering, welding, or crimping, are time-consuming, costly, and lack precision, making them unsuitable for complex or high-density interconnect applications.
Innovation Solution
A method involving the formation of a grid pattern from a planar sheet of conductive material, attached to a dielectric substrate, where separate conductive traces are created by severing connections from the grid pattern, allowing for precise interconnection of flat flexible cables and flexible printed circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional methods such as soldering, welding, or crimping are used to create electrical connections, then manual labor and time are required, but manufacturing costs increase and connection quality becomes inconsistent
Solution Approach 1:
The conductive material is divided into a grid pattern of interconnected traces, allowing individual traces to be selectively severed and connected to specific cables. This segmentation enables automated connection processes while maintaining consistent connection quality across multiple manufacturing cycles.
Solution Approach 2:
The grid pattern of conductive traces is pre-formed on the substrate before cable connections are made. This preliminary preparation allows for rapid automated connections without manual intervention, improving both productivity and connection consistency.
2Adaptability or versatility
If printed circuit boards are used to facilitate electrical connections, then scalability and repeatability are improved, but flexibility and conformal interconnections are lost due to rigid nature
Solution Approach 1:
The patent uses a flexible substrate with printed conductive traces instead of a rigid PCB. This flexible printed circuit structure maintains the repeatability and scalability of PCB manufacturing while enabling conformal interconnections and flexible routing to accommodate various cable arrangements.
3Reliability
If wire bonding or ribbon bonding techniques are used to establish electrical connections, then reliable connections are achieved in certain applications, but complexity of interconnections is limited and high-density interconnect applications are not suitable
Solution Approach 1:
The grid pattern of conductive traces provides a universal interconnection structure that can accommodate various cable types, connection densities, and routing configurations. This multi-functional approach replaces multiple specialized bonding techniques with a single versatile printed circuit system capable of handling both simple and complex interconnections.
Data Source
AI summary
A method is disclosed for interconnecting electrical conductors using a grid pattern formed from an electrically conductive material on a dielectric substrate. The grid pattern includes regularly spaced apertures forming an interconnected grid array of conductive traces. By severing connections between a separate conductive trace and the rest of the grid array, individual conductive traces are created. A first conductor from a first electrical cable is attached to a first contact pad defined by one of the separate conductive traces, and a second conductor from a second electrical cable is attached to a second contact pad defined by another separate conductive trace. This arrangement enables the interconnection of the first conductor to the second conductor via the separate conductive trace.