Copper-Clad Laminate Film Tie Layer for High-Frequency Adhesion
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Solution Overview
Problem
Existing copper-clad laminate films face challenges in achieving improved dielectric characteristics at high frequencies, maintaining coatability of the substrate surface, and ensuring excellent room-temperature and high-temperature adhesion between the substrate and the copper foil.
Innovation Solution
A copper-clad laminate film comprising a fluorine-containing substrate, a tie layer with a metal or metal alloy having a metal-oxygen bond dissociation energy of 400 kJ/mol or more, and a copper layer, where the tie layer has a thickness of about 10 nm to 100 nm, enhancing dielectric properties and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coating layer is formed on the substrate surface to improve dielectric characteristics at high frequencies, then dielectric characteristics are improved, but coatability of substrate surface and adhesion between substrate and copper foil deteriorate
Solution Approach 1:
The invention divides the coating structure into multiple functional layers: a fluorine-containing resin layer for dielectric performance and a silane coupling agent layer for adhesion enhancement. This segmentation allows each layer to perform its specific function without interfering with the other, resolving the contradiction between dielectric characteristics and adhesion.
Solution Approach 2:
The silane coupling agent acts as an intermediary layer between the fluorine-containing resin coating and the copper foil. It chemically bonds to both the resin and the metal surface, serving as a bridge that transfers and strengthens the adhesive connection while preserving the dielectric properties of the fluorine layer.
2Reliability
If a coating layer is formed on the substrate surface to improve dielectric characteristics at high frequencies, then dielectric characteristics are improved, but coatability of substrate surface deteriorates
Solution Approach 1:
The invention modifies the surface parameters of the fluorine-containing resin coating by introducing silane functional groups that alter surface energy and wettability. This parameter change enables better coating application and adhesion while preserving the bulk dielectric properties of the fluorine resin.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed copper-clad laminate film exhibits improved dielectric characteristics at high frequencies, maintains excellent coatability, and achieves strong adhesion between the substrate and the copper foil at both room temperature and high temperatures.
Implementation Method 1
the tie layer is a metal layer or a metal alloy layer including a metal having a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more
Data Source
AI summary
Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes a fluorine-containing substrate, a tie layer disposed on the fluorine-containing substrate, and a copper layer disposed on the tie layer, wherein the tie layer may be a metal layer or metal alloy layer including a metal of a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more, and the tie layer may have a thickness of about 10 nm to about 100 nm.